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CP323

Central Semiconductor
Part Number CP323
Manufacturer Central Semiconductor
Description Small Signal Transistor
Published Oct 10, 2008
Detailed Description PROCESS Small Signal Transistor CP323 Central TM NPN - Darlington Transistor Chip Semiconductor Corp. PROCESS DET...
Datasheet PDF File CP323 PDF File

CP323
CP323


Overview
PROCESS Small Signal Transistor CP323 Central TM NPN - Darlington Transistor Chip Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area www.
DataSheet4U.
com EPITAXIAL PLANAR 26.
8 x 26.
8 MILS 9.
0 MILS 4.
2 x 4.
2 MILS 4.
3 x 4.
3 MILS Al Au - 18,000Å Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 15,900 PRINCIPAL DEVICE TYPES BSS52 BST52 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.
centralsemi.
com R1 (1-August 2002) Central TM PROCESS CP323 Semiconductor Corp.
Typical Electrical Characteristics www.
DataSheet4U.
com 145 Adams Avenue Hauppauge, NY 1...



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