DatasheetsPDF.com

NTLJS1102P

ON Semiconductor
Part Number NTLJS1102P
Manufacturer ON Semiconductor
Description Power MOSFET
Published Jan 17, 2009
Detailed Description NTLJS1102P www.DataSheet4U.com Power MOSFET −8 V, −8.1 A, mCOOL] Single P−Channel, 2x2 mm, WDFN package Features • WDF...
Datasheet PDF File NTLJS1102P PDF File

NTLJS1102P
NTLJS1102P

Overview
NTLJS1102P www.
DataSheet4U.
com Power MOSFET −8 V, −8.
1 A, mCOOL] Single P−Channel, 2x2 mm, WDFN package Features • WDFN Package with Exposed Drain Pad for Excellent Thermal • • • • • • Conduction Lowest RDS(on) in 2 x 2 mm Package 1.
2 V RDS(on) Rating for Operation at Low Voltage Logic Level Gate Drive 2 x 2 mm Footprint Same as SC−88 Package Low Profile (<0.
8 mm) for Easy Fit in Thin Environments This is a Halide−Free Device This is a Pb−Free Device http://onsemi.
com V(BR)DSS RDS(on) MAX 36 mW @ −4.
5 V 45 mW @ −2.
5 V −8.
0 V 68 mW @ −1.
8 V 90 mW @ −1.
5 V 300 mW @ −1.
2 V S ID MAX −6.
2 A −5.
5 A −3.
0 A −1.
0 A −0.
2 A Applications • High Side Load Switch • Li Ion Battery Linear Mode Charging • Optimized for Battery and Load Management Applications in Portable Equipment MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain Current (Note 1) Power Dissipation (Note 1) Continuous Drain Current (Note 2) Power Dissipation (Note 2) Steady State tv5s Steady State tv5s TA = 25°C Steady State TA = 85°C TA = 25°C tp = 10 ms ID TA = 25°C TA = 85°C TA = 25°C TA = 25°C PD 3.
3 −3.
7 −2.
7 0.
7 −30 −55 to 150 −5.
5 260 A ID Symbol VDSS VGS Value −8 ±6 −6.
2 −4.
5 −8.
1 1.
9 W Pin 1 A Unit V V S G D P−CHANNEL MOSFET D WDFN6 CASE 506AP MARKING DIAGRAM 1 2 J6MG G 3 6 5 4 J6 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PD IDM TJ, TSTG IS TL W A °C A °C D D G 1 2 3 S (Top View) D Pulsed Drain Current Operating Junction and Storage Temperature PIN CONNECTIONS 6 5 4 D D S Source Current (Body Diode) (Note 2) Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) 1.
Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.
127 in sq [2 oz] including traces).
2.
Surface−mounted on FR4 board using the minimum recommended pad size (Cu area = 30 mm2 [2 oz] including traces).
ORDERING INFORMATION See detailed ordering and shipping information in t...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)