DatasheetsPDF.com

S3CI9E0x01

Samsung Semiconductor
Part Number S3CI9E0x01
Manufacturer Samsung Semiconductor
Description CMOS Microcontroller
Published Feb 1, 2009
Detailed Description S3CI9E0X01 www.DataSheet4U.com FLASH INTERFACE DEVICE S3CI9E0X01 SPECIFICATION Version : Ver. 1.0 Date : Jul. 16. 200...
Datasheet PDF File S3CI9E0x01 PDF File

S3CI9E0x01
S3CI9E0x01

Overview
S3CI9E0X01 www.
DataSheet4U.
com FLASH INTERFACE DEVICE S3CI9E0X01 SPECIFICATION Version : Ver.
1.
0 Date : Jul.
16.
2003 Samsung Electronics Co.
, LTD Semiconductor Flash Memory Product Planning & Applications SAMSUNG ELECTRONICS 1 S3CI9E0X01 www.
DataSheet4U.
com FLASH INTERFACE DEVICE Revision History Revision No.
0.
0 Initial Draft History Draft Date Jan.
24 2002 0.
1 1.
On page 18, BSC is moved from bufferRAM Write Protection command register to system configuration register and bufferRAM Write Protection command register is removed.
2.
Host Interface & NAND Flash Interface (page 3) : 1.
8V 0.
2 --> 1.
8V / 2.
5V / 3.
0V Mar.
13 2002 th th Remark Preliminary Jan.
25 2002 th Preliminary 1.
Package information is added.
2.
Some description is updated.
3.
Controller ID register default value is modified.
(Page 14) 4.
Write Protection NAND Flash commands are changed, and description are updated.
(Page 23, 56) Preliminary 0.
3 1.
Package pin configuration is changed.
(page9) 2.
Software algorithm of detecting NAND Flash type is added.
(page 18, 58) - CE2Ena : 11 bit of system configuration register is changed from ‘reserved’ to ‘CE2Ena’.
Apr.
15 2002 th Preliminary 0.
4 1.
Minimum latency at sync.
Read is changed from 2clocks to 3clocks 2.
Technical notes are added - Write Protection truth table is updated(page 58) - Write Protection guidance is updated(page 58) - Internal register reset case is updated(page 61) - Pin connection guidance between Host and Eagle (page 61) - Asynchronous Page Read guidance (page 62) 3.
DC/AC parameter is updated(page64~66) : 1 release parameter 4.
tASC parameter is removed.
tAES parameter is added st Jun.
21 2002 th Preliminary SAMSUNG ELECTRONICS 2 S3CI9E0X01 www.
DataSheet4U.
com FLASH INTERFACE DEVICE 4.
Package dimension information is updated (page63~64) 5.
Some descriptions are modified & added th 0.
5 1.
Vcc is available on 1.
8V and 2.
5V part.
2.
Pin J2 is changed from NC to DNU.
3.
Fig30(State diagram of NAND Flash ...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)