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CF5012

Nippon Precision Circuits
Part Number CF5012
Manufacturer Nippon Precision Circuits
Description Low-current Consumption Crystal Oscillator Module ICs
Published Apr 25, 2009
Detailed Description CF5012 series Low-current Consumption Crystal Oscillator Module ICs www.datasheet4u.com OVERVIEW The CF5012 series are ...
Datasheet PDF File CF5012 PDF File

CF5012
CF5012

Overview
CF5012 series Low-current Consumption Crystal Oscillator Module ICs www.
datasheet4u.
com OVERVIEW The CF5012 series are low-current consumption 3rd-harmonic crystal oscillator module ICs.
Internal circuit optimization means these devices have reduced current consumption in comparison with our existing 3rd-harmonic oscillator devices.
The crystal oscillator circuit has a built-in thin-film feedback resistor with good temperature characteristics and built-in capacitors with excellent frequency response, resulting in a stable 3rdorder overtone oscillator with only the connection of a crystal element.
FEATURES I I I I I I 3rd-harmonic oscillation 2.
7 to 3.
6V operating supply voltage range 30 to 45MHz recommended operating frequency range Inverter amplifier feedback resistor built-in Oscillator capacitors CG , CD built-in Output three-state function (high impedance in standby mode) I I I I I fO output frequency (oscillator frequency) 8mA output drive capability (VDD = 2.
7V) 6.
5mA (typ) low current consumption (VDD = 3V, CL = 15pF, f = 40MHz) CMOS output duty level Chip form (CF5012×××) SERIES CONFIGURATION Version CF5012ANB Recommended operating frequency [MHz] 30 to 45 Built-in capacitance [pF] gm ratio CG 1.
0 8 CD 15 Rf [kΩ] 3.
1 Note: Recommended operating frequency is not the guaranteed value but is measured using NPC’s standard crystal.
ORDERING INFORMATION Device CF5012×××–1 Package Chip form NIPPON PRECISION CIRCUITS INC.
—1 CF5012 series PAD LAYOUT (Unit:µm) www.
datasheet4u.
com VDD Q (920,1180) Y HA5012ANB (0,0) INHN XTN XT VSS X Chip size: 0.
92 × 1.
18 mm Chip thickness: 300 ± 30 µm Chip base: VDD level PIN DESCRIPTION and PAD DIMENSIONS Pad dimensions [µm] Name INHN XT XTN VSS Q VDD I/O I I O – O – Description X Output state control input.
High impedance when LOW.
Pull-up resistor built in Amplifier input Amplifier output Ground Output.
Output frequency.
High impedance in standby mode Supply voltage Crystal oscillator connection pins.
Crystal oscill...


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