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NJU6312

NJR Corporation
Part Number NJU6312
Manufacturer NJR Corporation
Description 0.9V Operation Fundamental Quartz Crystal Oscillator IC
Published Jul 18, 2009
Detailed Description NJU6312 Series www.DataSheet4U.com 0.9V Operation Fundamental Quartz Crystal Oscillator IC for Flip !GENERAL DESCRIPTIO...
Datasheet PDF File NJU6312 PDF File

NJU6312
NJU6312

Overview
NJU6312 Series www.
DataSheet4U.
com 0.
9V Operation Fundamental Quartz Crystal Oscillator IC for Flip !GENERAL DESCRIPTION The NJU6312 series is C-MOS quartz crystal oscillator IC for fundamental (up to 80MHz) oscillation.
The pad arrangement suitable for flip die mount simplifies development of small-sized oscillator.
The operating voltage is from 0.
9V to 3.
0V, and the pad layout is for flip die based on smaller ceramic package.
The 5-stage divider generates only one frequency selected of f0,f0/2,f0/4 f0/8, f0/16 and f0/32 by internal circuits is output.
The oscillation amplifier is realized very low stand-by current using NAND circuit.
Furthermore, The 3-state output buffer is C-MOS compatible.
!FEATURES "Operating Voltage 0.
9 to 3.
0V "Maximum Oscillation Frequency 80MHz "Low Operating Current "5-Stage Divider Maximum Divider f0/32 "Oscillation Stop and Output Stand-by Function "3-State Output Buffer "Oscillation Capacitors Cg and Cg on-chip "Pad Layout for Flip Die "Package Outline Thin-Die "C-MOS Technology !LINE-UP TABLE Type No.
A B C D E F FOUT f0 f0/2 f0/4 f0/8 f0/16 f0/32 Internal Connect Connected A Line Connected B Line Connected C Line Connected D Line Connected E Line Connected F Line Cg/Cd 8/9pF 8/9pF 8/9pF 8/9pF 8/9pF 8/9pF !PAKAGE OUTLINE NJU6312XC-L !PAD LOCATION Thin-Die XT VDD FOUT XT CONT VSS !COORDINATES No 1 2 3 4 5 6 Pad Name XT VDD FOUT VSS CONT XT X -271 -271 -271 271 271 271 Y 171 -17 -171 -171 17 171 NJU6312 !EXAMPLE OF PART NUMBER 1)NJU6312AW-L FOUT=f0, Wafer Thickness=140um 2)NJU6312CC-L FOUT= f0/4, Die Thickness=140um !BLOCK DIAGRAM XT Rf XT Cg Cd A CONT B C D 1/2 1/2 1/2 Starting Point: Die Center Unit[um] Die Size: 0.
8x0.
6mm Die Thickness (C-L): 140±10um Wafer Thickness (W-L): 140±10um Pad size: 90x90um Die Substrate: VDD level VDD VSS 1/2 1/2 E F 3-STATE BUFFER FOUT 2009/03/19 ( 1 / 6 ) NJU6312 Series www.
DataSheet4U.
com !TERMINAL DESCRIPTION SYMBOL FUNCTION CONT Oscillation and 3-state Output Buffer Control CONT FOUT O...


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