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MSB709-RT1

Motorola Semiconductor Products
Part Number MSB709-RT1
Manufacturer Motorola Semiconductor Products
Description Small Signal Plastic Pnp
Published Oct 14, 2009
Detailed Description MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MSB709–RT1/D PNP General Purpose Amplifier Transistor Su...
Datasheet PDF File MSB709-RT1 PDF File

MSB709-RT1
MSB709-RT1

Overview
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MSB709–RT1/D PNP General Purpose Amplifier Transistor Surface Mount COLLECTOR 3 MSB709-RT1 Motorola Preferred Device 3 2 1 2 BASE 1 EMITTER Unit Vdc Vdc Vdc mAdc mAdc MAXIMUM RATINGS (TA = 25°C) Rating Collector–Base Voltage Collector–Emitter Voltage Emitter–Base Voltage Collector Current — Continuous Collector Current — Peak Symbol V(BR)CBO V(BR)CEO V(BR)EBO IC IC(P) Value – 60 – 45 – 7.
0 –100 – 200 CASE 318D–03, STYLE 1 SC–59 THERMAL CHARACTERISTICS Characteristic Power Dissipation Junction Temperature Storage Temperature Symbol PD TJ Tstg Max 200 150 – 55 ~ +150 Unit mW °C °C ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Collector–Emitter Breakdown Voltage (IC = – 2.
0 mAdc, IB = 0) Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0) Emitter–Base Breakdown Voltage (IE = –10 µAdc, IE = 0) www.
DataSheet4U.
com Collector–Base Cutoff Current (VCB = –45 Vdc, IE = 0) Collector–Emitter Cutoff Current (VCE = –10 Vdc, IB = 0) DC Current Gain(1) (VCE = –10 Vdc, IC = – 2.
0 mAdc) Collector–Emitter Saturation Voltage (IC = –100 mAdc, IB = –10 mAdc) 1.
Pulse Test: Pulse Width ≤ 300 µs, D.
C.
≤ 2%.
Symbol V(BR)CEO V(BR)CBO V(BR)EBO ICBO ICEO hFE1 VCE(sat) Min – 45 – 60 – 7.
0 — — 210 — Max — — — – 0.
1 –100 340 – 0.
5 Unit Vdc Vdc Vdc µAdc nAdc — Vdc DEVICE MARKING Marking Symbol ARX The “X” represents a smaller alpha digit Date Code.
The Date Code indicates the actual month in which the part was manufactured.
Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3 © Motorola, Inc.
1996 Motorola Small–Signal Transistors, FETs and Diodes Device Data 1 MSB709-RT1 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design.
The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.
037...


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