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FCSP0530ETR

Part Number	FCSP0530ETR
Manufacturer	Vishay Siliconix
Description	chip scale packaging to deliver Schottky diodes
Published	Oct 22, 2009
Detailed Description	FCSP0530ETR Vishay High Power Products FlipKY®, 0.5 A FEATURES • • • • • Ultralow VF to footprint area Very low profile...
Datasheet	FCSP0530ETR PDF File

Overview

FCSP0530ETR Vishay High Power Products FlipKY®, 0.
5 A FEATURES • • • • • Ultralow VF to footprint area Very low profile (< 0.
6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS • • • • • Reverse polarity protection Current steering Freewheeling Flyback Oring FlipKY® DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry.
The three pad 0.
9 mm x 1.
2 mm devices can deliver up to 0.
5 A and occupy only 1.
08 mm2 of board space.
The anode and cathode connections are made through solder bump pads on one side of the silicon rather than t...

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FCSP0530ETR chip scale packaging to deliver Schottky diodes - Vishay Siliconix

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