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B6NC60

STMicroelectronics
Part Number B6NC60
Manufacturer STMicroelectronics
Description STB6NC60
Published Dec 17, 2009
Detailed Description N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/I2PAK PowerMESH™II MOSFET TYPE STP(B)6NC60(-1) STP6NC60FP s s s s s STP6NC60 -...
Datasheet PDF File B6NC60 PDF File

B6NC60
B6NC60

Overview
N-CHANNEL 600V - 1Ω - 6A TO-220/TO-220FP/I2PAK PowerMESH™II MOSFET TYPE STP(B)6NC60(-1) STP6NC60FP s s s s s STP6NC60 - STP6NC60FP STB6NC60-1 VDSS 600 V 600 V RDS(on) < 1.
2 Ω < 1.
2 Ω ID 6A 6A 3 1 2 TYPICAL RDS(on) = 1.
0 Ω EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED NEW HIGH VOLTAGE BENCHMARK GATE CHARGE MINIMIZED TO-220 TO-220FP DESCRIPTION The PowerMESH™II is the evolution of the first generation of MESH OVERLAY™.
The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge for what concerns swithing speed, gate charge and ruggedness.
APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING s SWITH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVES s 12 3 I2PAK INTERNAL SCHEMATIC DIAGRAM www.
DataSheet4U.
com ABSOLUTE MAXIMUM RATINGS Symbol VDS VDGR VGS ID ID IDM (q) PTOT dv/dt (1) VISO Tstg Tj Parameter Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kΩ) Gate- source Voltage Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Peak Diode Recovery voltage slope Insulation Withstand Voltage (DC) Storage Temperature Max.
Operating Junction Temperature –65 to 150 150 (1)ISD ≤6A, di/dt ≤100A/µs, V DD ≤ V(BR)DSS, Tj ≤ TJMAX.
Value STP(B)6NC60(-1) STP6NC60FP 600 600 ±30 6 3.
8 24 125 1.
0 3 2500 6(*) 3.
8(*) 24(*) 40 0.
32 Unit V V V A A A W W/°C V/ns V °C °C (•)Pulse width limited by safe operating area (*) Limited only by maximum temperature allowed May 2001 1/10 STP6NC60/FP/STB6NC60-1 THERMAL DATA TO-220/I2PAK Rthj-case Rthj-amb Rthc-sink Tl Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose 1.
0 62.
5 0.
5 300 TO-220FP 3.
1 °C/W °C/W °C/W °C AVALANCHE CHARACTERISTICS Symbol IAR EAS Parameter Avalanche Current, Repet...


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