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MBM29DL322BD

Fujitsu Media Devices
Part Number MBM29DL322BD
Manufacturer Fujitsu Media Devices
Description (MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
Published Jan 6, 2010
Detailed Description FUJITSU SEMICONDUCTOR DATA SHEET DS05-20873-4E FLASH MEMORY CMOS 32M (4M × 8/2M × 16) BIT Dual Operation MBM29DL32X...
Datasheet PDF File MBM29DL322BD PDF File

MBM29DL322BD
MBM29DL322BD

Overview
FUJITSU SEMICONDUCTOR DATA SHEET DS05-20873-4E FLASH MEMORY CMOS 32M (4M × 8/2M × 16) BIT Dual Operation MBM29DL32XTD/BD s FEATURES -80/90/12 • 0.
33 µm Process Technology • Simultaneous Read/Write operations (dual bank) Multiple devices available with different bank sizes (Refer to Table 1) Host system can program or erase in one bank, then immediately and simultaneously read from the other bank Zero latency between read and write operations Read-while-erase Read-while-program • Single 3.
0 V read, program, and erase Minimizes system level power requirements (Continued) s PRODUCT LINE UP Part No.
www.
DataSheet4U.
com MBM29DL32XTD/MBM29DL32XBD +0.
3 V –0.
3 V +0.
6 V –0.
3 V VCC = 3.
3 V VCC = 3.
0 V 80 — 80 80 30 — 90 90 90 35 — 12 120 120 50 Ordering Part No.
Max.
Address Access Time (ns) Max.
CE Access Time (ns) Max.
OE Access Time (ns) s PACKAGES 48-pin plastic TSOP (I) Marking Side 48-pin plastic TSOP (I) 57-ball plastic FBGA Marking Side (FPT-48P-M19) (FPT-48P-M20) (BGA-57P-M01) Em\edded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
MBM29DL32XTD/BD-80/90/12 (Continued) • Compatible with JEDEC-standard commands Uses same software commands as E2PROMs • Compatible with JEDEC-standard world-wide pinouts 48-pin TSOP(I) (Package suffix: PFTN – Normal Bend Type, PFTR – Reversed Bend Type) 57-ball FBGA (Package suffix: PBT) • Minimum 100,000 program/erase cycles • High performance 80 ns maximum access time • Sector erase architecture Eight 4K word and sixty-three 32K word sectors in word mode Eight 8K byte and sixty-three 64K byte sectors in byte mode Any combination of sectors can be concurrently erased.
Also supports full chip erase.
• Boot Code Sector Architecture T = Top sector B = Bottom sector • Hidden ROM (Hi-ROM) region 64K byte of Hi-ROM, accessible through a new “Hi-ROM Enable” command sequence Factory serialized and protected to provide a secure electronic serial number (ESN) • WP/ACC input pin At VIL, allows p...


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