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WED3C755E8M-XBX

Part Number	WED3C755E8M-XBX
Manufacturer	White Electronic Designs Corporation
Description	RISC MICROPROCESSOR MULTI-CHIP PACKAGE
Published	Mar 21, 2010
Detailed Description	www.DataSheet4U.com White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC...
Datasheet	WED3C755E8M-XBX PDF File

Overview

www.
DataSheet4U.
com White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.
The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, conﬁgured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) Maximum 60x Bus frequency = 66MHz FEATURES The WED3C755E8M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°...

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WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE - White Electronic Designs Corporation

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