DatasheetsPDF.com

GS8662S18E-333

Part Number	GS8662S18E-333
Manufacturer	GSI Technology
Description	DDR SigmaSIO-II SRAM
Published	Apr 28, 2010
Detailed Description	Preliminary GS8662S08/09/18/36E-333/300/250/200/167 www.DataSheet4U.com 165-Bump BGA Commercial Temp Industrial Temp Fea...
Datasheet	GS8662S18E-333 PDF File

Overview

Preliminary GS8662S08/09/18/36E-333/300/250/200/167 www.
DataSheet4U.
com 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaSIO™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write controls sampled at data-in time • DLL circuitry for wide output data valid window and future frequency scaling • Burst of 2 Read and Write • 1.
8 V +100/–100 mV core power supply • 1.
5 V or 1.
8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ mode pin for programmable output drive strength • IEEE 1149.
1 JTAG-compliant Boundary Scan • Pin-compatible with future 144Mb devices • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available 72Mb Burst of 2 DDR SigmaSIO-II SRAM 333 MHz–167 MHz 1.
8 V VDD 1.
8 V and 1.
5 V I/O Bottom View 165-Bump, 15 mm x 17 mm BGA 1 mm Bump Pitch, 11 x 15 Bump Array JEDEC Std.
MO-216, Variation CAB-1 SigmaRAM™ Family Over...

Similar Datasheet

GS8662S18E-300 DDR SigmaSIO-II SRAM - GSI Technology
GS8662S18E-333 DDR SigmaSIO-II SRAM - GSI Technology

@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)