DatasheetsPDF.com

AMMP-6530

Agilent Technologies
Part Number AMMP-6530
Manufacturer Agilent Technologies
Description 5-30 GHz Image Reject Mixer
Published May 1, 2010
Detailed Description Agilent AMMP-6530 5– 30 GHz Image Reject Mixer Data Sheet w w w . D a t a S h e e t 4 U . c o Features • 5x5 mm Surfac...
Datasheet PDF File AMMP-6530 PDF File

AMMP-6530
AMMP-6530

Overview
Agilent AMMP-6530 5– 30 GHz Image Reject Mixer Data Sheet w w w .
D a t a S h e e t 4 U .
c o Features • 5x5 mm Surface Mount Package • Broad Band Performance 5 – 30 GHz • Low Conversion Loss of 8 dB • High Image Rejection of 15 – 20 dB • Good 3rd Order Intercept of +18 dBm Description Agilent’s AMMP-6530 is an image reject mixer that operates from 5 GHz to 30 GHz.
The cold channel FET mixer is designed to be an easy-to-use component for any surface mount PCB application.
It can be used drain pumped for low conversion loss applications, or when gate pumped the mixer can provide high linearity for SSB up-conversion.
An external 90-degree hybrid is used to achieve image rejection and a -1V voltage reference is needed.
Intended applications include microwave radios, 802.
16, VSAT, and satellite receivers.
Since this one mixer can cover several bands, the AMMP-6530 can reduce part inventory.
The integrated mixer eliminates complex tuning and assembly processes typically required by hybrid (discrete-FET or diode) mixers.
The package is fully SMT compatible with backside grounding and I/O to simplify assembly.
8 RF NC 7 Vg 6 NC 5 IF2 3 NC 2 IF1 1 • Single -1V, no current Supply Bias Applications • Microwave Radio Systems • Satellite VSAT, DBS Up/Down Link • LMDS & Pt-Pt mmW Long Haul • Broadband Wireless Access (including 802.
16 and 802.
20 WiMax) • WLL and MMDS loops • Commercial grade military gate 4 Pin 1 2 3 4 5 6 7 8 Function IF1 IF2 LO Vg RF Top view package base: GND Absolute Maximum Ratings [1] Symbol Vg Pin Tch Tstg Tmax Parameters/Conditions Gate Supply Voltage CW Input Power Operating Channel Temperature Storage Case Temperature Max.
Assembly Temp (60 sec max) Units V dBm °C °C °C Min.
0 Max.
-3 15 +150 -65 +150 +300 Note: 1.
Operation in excess of any one of these conditions may result in permanent damage to this device.
Attention: Observe precautions for handling electrostatic sensitive devices.
ESD Machine Model (Class A) ESD Human Body Model (...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)