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W3H32M72E-XSBX

Part Number	W3H32M72E-XSBX
Manufacturer	White Electronic Designs
Description	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
Published	May 14, 2010
Detailed Description	White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rat...
Datasheet	W3H32M72E-XSBX PDF File

Overview

White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Package: • 208 Plastic Ball Grid Array (PBGA), 18 x 20mm • 1.
0mm pitch Differential data strobe (DQS, DQS#) per byte www.
DataSheet4U.
com Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data – output drive strength Single 1.
8V ±0.
1V supply Programmable CAS latency: 3, 4, 5, or 6 Posted CAS additive latency: 0, 1, 2, 3 or 4 Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature Ranges Organized as 32M x 72 Weight: W3H32M72E-XSBX - 2.
5 grams typical BENEFITS 65% SPACE SAVINGS vs.
FPBGA Reduced part count 54% I/O reduction vs FPBGA Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Upgradable to 64M x 72 density (contact factory for information) * This product is under development, is not qualiﬁed or characterized and is subject to change without notice.
FIGURE 1 – DENSITY COMPARISONS Actual Size W3H32M72E-XSBX 11.
0 CSP Approach (mm) 11.
0 11.
0 11.
0 11.
0 20 19.
0 90 FBGA 90 FBGA 90 FBGA 90 FBGA 90 FBGA White Electronic Designs W3H32M72E-XSBX 18 S A V I N G S 65% 54% Area I/O Count 5 x 209mm2 = 1,045mm2 5 x 90 balls = 450 balls 360mm2 208 Balls White Electronic Designs Corp.
reserves the right to change products or speciﬁcations without notice.
February 2006 Rev.
2 1 White Electronic Designs Corporation • (602) 437-1520 • www.
wedc.
com White Electronic Designs W3H32M72E-XSBX PRELIMINARY* FIGURE 2 – FUNCTIONAL BLOCK DIAGRAM CS# WE# RAS# CAS# CKE CS# WE# RAS# CAS# CKE ODT A0-12 BA0-1 DQ0 ¥ CK CK# LDM UDM LDQS LDQS# UDQS UDQS# ODT A0-12 BA0-1 CK0 CK0# LDM0 DQ0 www.
DataSheet4U.
com U0 UDM0 ...

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W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package - White Electronic Designs

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