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TLRMHGH48F

Toshiba Semiconductor
Part Number TLRMHGH48F
Manufacturer Toshiba Semiconductor
Description BI-COLOR HIGH LUMINOSITY INDICATOR
Published Dec 8, 2010
Detailed Description TLRMHGH48T(F) TOSHIBA LED Lamp InGaAlP Red/Green Light Emission TLRMHGH48T(F) ○ BI-COLOR HIGH LUMINOSITY INDICATOR Incl...
Datasheet PDF File TLRMHGH48F PDF File

TLRMHGH48F
TLRMHGH48F

Overview
TLRMHGH48T(F) TOSHIBA LED Lamp InGaAlP Red/Green Light Emission TLRMHGH48T(F) ○ BI-COLOR HIGH LUMINOSITY INDICATOR Includes protruded resin.
Unit: mm • • • • • • Lead(Pb) free(Sn-Ag-Cu) High Luminous Intensity.
5mm package InGaAlP Red/Green LED, the cathode is common to two colors.
All plastic mold type.
Transparent Lens.
Absolute Maximum Ratings (Ta = 25°C) CHARACTERISTICS FORWARD CURRENT REVERSE VOLTAGE POWER DISSIPATION OPERATING TEMPERATURE SYMBOL IF VR Topr Tstg RATING 50 (Note) 4 −40~100 −40~120 UNIT mA V °C °C Stopper Note: Using continuously under heavy loads (e.
g.
the application of high Anode(Red) temperature/current/voltage and the significant change in Common Cathode temperature, etc.
) may cause this product to decrease in the Anode(Green) reliability significantly even if the operating conditions (i.
e.
operating temperature/current/voltage, etc.
) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the JEDEC ― Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual JEITA ― reliability data (i.
e.
reliability test report and estimated failure rate, TOSHIBA 4-5AR1 etc).
Note: Maximum rating of “forward current – atmospheric Weight: 0.
37 g (typ.
) temperature (i.
e.
IF-Ta graph in the next page)” is for each component.
In case two components lightening, total current should be within the rating.
PRECAUTIONS Please be careful of the followings • Soldering temperature : 260 max Soldering time :3 s max (Soldering portion of lead : below the lead stopper of the device) • If the lead is formed, the lead should be formed up to below the lead stopper of the device without Formed stress to the resin.
Soldering should be performed after lead forming.
• The visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta = 25°C) CH...


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