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NTMD4N03R2

ON Semiconductor
Part Number NTMD4N03R2
Manufacturer ON Semiconductor
Description Power MOSFET
Published Feb 16, 2011
Detailed Description NTMD4N03R2 Power MOSFET 4 Amps, 30 Volts N−Channel SO−8 Dual Features www.DataSheet4U.com • Designed for use in low vo...
Datasheet PDF File NTMD4N03R2 PDF File

NTMD4N03R2
NTMD4N03R2

Overview
NTMD4N03R2 Power MOSFET 4 Amps, 30 Volts N−Channel SO−8 Dual Features www.
DataSheet4U.
com • Designed for use in low voltage, high speed switching applications • Ultra Low On−Resistance Provides Higher Efficiency and Extends Battery Life − RDS(on) = 0.
048 W, VGS = 10 V (Typ) − RDS(on) = 0.
065 W, VGS = 4.
5 V (Typ) Miniature SO−8 Surface Mount Package − Saves Board Space Diode is Characterized for Use in Bridge Circuits Diode Exhibits High Speed, with Soft Recovery Dc−Dc Converters Computers Printers Cellular and Cordless Phones Disk Drives and Tape Drives VDSS 30 V http://onsemi.
com RDS(ON) TYP 48 mΩ @ VGS = 10 V ID MAX 4.
0 A • • • • • • • • N−Channel D D Applications G S G S MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Drain−to−Source Voltage Gate−to−Source Voltage − Continuous Drain Current − Continuous @ TA = 25°C − Single Pulse (tp ≤ 10 ms) Total Power Dissipation @ TA = 25°C (Note 1) Operating and Storage Temperature Range Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 5.
0 Vdc, Peak IL = 4.
45 Apk, L = 8 mH, RG = 25 Ω) Thermal Resistance − Junction−to−Ambient (Note 1) Maximum Lead Temperature for Soldering Purposes for 10 seconds Symbol VDSS VGS ID IDM PD TJ, Tstg EAS Value 30 "20 4.
0 12 2.
0 −55 to +150 80 Unit Volts Volts Adc Apk Watts °C mJ 8 1 SO−8 CASE 751 STYLE 11 MARKING DIAGRAM & PIN ASSIGNMENTS Source−1 Gate−1 Source−2 Gate−2 1 2 3 4 (Top View) E4N03 LYWW 8 7 6 5 Drain−1 Drain−1 Drain−2 Drain−2 RqJA TL 62.
5 260 °C/W °C E4N03 L Y WW = Device Code = Assembly Location = Year = Work Week 1.
When surface mounted to an FR4 board using 1″ pad size, t ≤ 10 s ORDERING INFORMATION Device NTMD4N03R2 Package SO−8 Shipping† 2500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004 1 May, 2004 − Rev.
1 Publication Ord...


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