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WT-Z210V-AU4

Weitron Technology
Part Number WT-Z210V-AU4
Manufacturer Weitron Technology
Description Zener Diode Chips(Dual Pad)
Published Mar 19, 2011
Detailed Description WT-Z210V-AU4 Zener Diode Chips (Dual Pad) for ESD Bidrectional Protection 1. Feature: 1-1 Silicon Zener diode chips for ...
Datasheet PDF File WT-Z210V-AU4 PDF File

WT-Z210V-AU4
WT-Z210V-AU4

Overview
WT-Z210V-AU4 Zener Diode Chips (Dual Pad) for ESD Bidrectional Protection 1.
Feature: 1-1 Silicon Zener diode chips for electrostatic discharge (ESD) protection application 1-2 This specification applies to N/P/N-Type silicon Zener diode chip (Dual pad/Vertical) Device NO:WT-Z210V-AU4 2.
Structure: 2-1 Planar type: Silicon Diode 2-2 Electrodes: Top side : Gold Pad.
(Cathode) Back side : Gold Layer.
(Anode) 3.
Size: 3-1 Chip size: 10.
0 mils x 10.
0 mils (254 um x 254 um).
3-2 Chip thickness: 4.
0 ± 1.
0 mils (100 ± 25.
4 um).
3-3 Dual Bonding pad: 7.
7 mils x 7.
7mils (195um x 195um).
3-4 Pattern drawing: Refer to the attached drawing.
4.
Electrical Characteristics (Ta=25 C) Parameter Zener Voltage Forward Voltage Reverse Leakage Current Electrostatic Discharge Symbol Vz (Top) Vz (Back) Vf Condition Iz=5mA Min.
5.
8 5.
4 Typ.
Max.
7.
0 6.
6 1.
2 Unit V IF=20mA V IR VR=4V HBM MIL-STD 883 100 nA ESD 8.
0 KV 5.
Drawing: Bonding pad Top side N P-Sub N 6.
Protection Circuit: (Top View) LED Protection Zener www.
DataSheet4U.
com Back Side Bonding pad WEITRON TECHNOLOGY CO.
, LTD.
Bonding pad TEL:886-2-29148158 FAX:886-2-29106796 Http://www.
weitron.
com.
tw 30 - Jun - 06 ...


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