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CP353V

Part Number	CP353V
Manufacturer	Central Semiconductor
Description	Small Signal Transistors NPN - High Current Transistor Chip
Published	Apr 1, 2011
Detailed Description	PROCESS Small Signal Transistors CP353V NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thic...
Datasheet	CP353V PDF File

Overview

PROCESS Small Signal Transistors CP353V NPN - High Current Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter 1 Bonding Pad Area Emitter 2 Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 3,878 PRINCIPAL DEVICE TYPES CZT853 EPITAXIAL PLANAR 66 x 66 MILS 7.
1 MILS 7.
9 x 7.
9 MILS 7.
9 x 9.
5 MILS 7.
9 x 9.
5 MILS Al-Si - 30,000Å Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å R2 (22-March 2010) w w w.
c e n t r a l s e m i .
c o m www.
DataSheet4U.
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c e n t r a l s e m i .
c o m www.
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