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MB1608221Y5x

Part Number	MB1608221Y5x
Manufacturer	ABC Taiwan Electronics
Description	MULTILAYER CHIP BEAD
Published	Jun 5, 2011
Detailed Description	SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO....
Datasheet	MB1608221Y5x PDF File

Overview

SPECIFICATION FOR APPROVAL REF : PROD.
NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO.
ABC'S ITEM NO.
MB1608□□□□5□ ¢¹¡O www.
DataSheet4U.
com D D C B I G PCB Pattern I Unit : m/m Series MB1608 A 1.
60±0.
15 B 0.
80±0.
15 C 0.
80±0.
15 D 0.
30±0.
20 G 0.
7 H 0.
7 H I 0.
7 ¢º¡O SCHEMATIC DIAGRAM ¡G ¢»¡O MATERIALS ¡G a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ.
include ferrite a b c Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.
) G ¢¼¡O GENERAL SPECIFICATION ¡G a¡ b¡ c¡ Storage temp.
O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.
5 time ( sec ) Temperature ( ¢J 250 50sec max.
G ¢ G Peak Temp¡ J J Operating temp.
O -25 ---- +85 ¡ Terminal Strength O 260 G ¢ max.
¢ J Max time above 230¢ J ¡ G 50sec max.
Max G time above 200¢ J ¡ G 70sec max.
Temperature Rising Area +4.
0¢J / sec max.
Preheat Area 150 ~ 200¢J / 60 ~ 120sec Reflow Area +2.
0 ~ 4.
0¢J / sec max.
Forced Cooling Area -(1.
0 ~ 5.
0)¢J / sec max.
Peak Temperature: 260¢J 230¢J 30±5 200 150 70sec max.
¡ G Solder : Sn96.
5 / Ag3 / Cu0.
5 or equivalent Solder temp.
: 260±5¢J Flux : Rosin Dip time : 4±1 seconds ) 100 50 0 50 100 150 Time ( seconds ) 200 250 AE-001A SPECIFICATION FOR APPROVAL REF : PROD.
NAME PAGE: 2 MULTILAYER CHIP BEAD ELECTRICAL CHARACTERISTICS ¡G DWG No.
MB1608100Y5□ MB1608300Y5□ MB1608600Y5□ MB1608121Y5□ MB1608221Y5□ MB1608301Y5□ Impedance (Ω) 10.
0±25% 30.
0±25% 60.
0±25% 120.
0±25% 220.
0±25% 300.
0±25% ABC'S DWG NO.
ABC'S ITEM NO.
MB1608 □□□□5□ ¢½¡O Z Test Freq.
( MHz ) 100 100 100 100 100 100 RDC (Ω) max.
0.
02 0.
03 0.
03 0.
10 0.
15 0.
20 Ir ( mA ) max.
2000 2000 2000 1000 800 600 1).
□¡ Packaging Information… G A Bulk B Taping Reel ¡ G ¡ ¢¾¡O IMPEDANCE VS.
FREQUENCY CHARACTERISTICS ¡G MB1068-100 MB1608-300 MB1608-600 MB1608-121 MB1608-221 MB1608-301 AE-001A SPECIFICATION FOR APPROVAL REF : PROD.
NAME PAGE: 3 MULTILAYER CHIP ...

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MB1608221Y5x MULTILAYER CHIP BEAD - ABC Taiwan Electronics

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