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SKCD09C060I3

Semikron International
Part Number SKCD09C060I3
Manufacturer Semikron International
Description CAL-DIODE
Published Jul 21, 2011
Detailed Description SKCD 09 C 060 I3 Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.1 mA Ts = 80 °C, ...
Datasheet PDF File SKCD09C060I3 PDF File

SKCD09C060I3
SKCD09C060I3

Overview
SKCD 09 C 060 I3 Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.
1 mA Ts = 80 °C, Tj = 150 °C 10 ms sin 180° Tj = 25 °C Tj = 150 °C Values 600 15 120 100 150 Unit V A A A °C CAL-DIODE IF = 20 A VRRM = 600 V Size: 2,95 mm x 2,95 mm SKCD 09 C 060 I3 Electrical Characteristics Symbol i2t IR VF V(TO) rT Conditions Tj = 150 °C, 10 ms, sin 180° Tj = 25 °C, VRRM = 600 V Tj = 125 °C, VRRM = 600 V Tj = 25 °C, IF = 15 A Tj = 125 °C, IF = 15 A Tj = 125 °C Tj = 125 °C min.
typ.
max.
50 0.
10 0.
50 Unit A2s mA mA V V V mΩ 1.
35 1.
35 0.
90 33.
0 1.
60 1.
60 Features • low forward voltage drop combined with a low temperature dependence • easy paralleling due to a small forward voltage spread • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to all standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs Tj = 25 °C, 10 A, 300 V, 200 A/µs Tj = 125 °C, 10 A, 300 V, 200 A/µs min.
typ.
max.
Unit µs ns 0.
8 1.
2 8 µC µC A A Typical Applications* • freewheeling diode for IGBT Thermal Characteristics Symbol Tj Tstg Tsolder Tsolder Rth(j-s) 10 min.
5 min.
sold.
on 0,38 mm DCB, reference point on copper heatsink close to the chip 2.
11 Conditions min.
-40 -40 typ.
max.
150 150 250 320 Unit °C °C °C °C K/W Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 2.
95 x 2.
95 8.
70 bondable (Al) solderable (Ag/Ni) Al, diameter ≤ 500 µm wafer frame 1171 (5" Wafer) Unit mm2 mm2 pcs SKCD © by SEMIKRON Rev.
0 – 18.
02.
2010 1 SKCD 09 C 060 I3 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of compon...


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