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SKCD47C170I

Semikron International
Part Number SKCD47C170I
Manufacturer Semikron International
Description CAL-DIODE
Published Aug 1, 2011
Detailed Description SKCD 47 C 170 I Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.2 mA Ts = 80 °C, T...
Datasheet PDF File SKCD47C170I PDF File

SKCD47C170I
SKCD47C170I

Overview
SKCD 47 C 170 I Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.
2 mA Ts = 80 °C, Tj = 150 °C 10 ms sin 180° Tj = 25 °C Tj = 150 °C Values 1700 40 720 550 150 Unit V A A A °C CAL-DIODE IF = 55 A VRRM = 1700 V Size: 6,8 mm x 6,8 mm SKCD 47 C 170 I Electrical Characteristics Symbol i2t IR VF V(TO) rT Conditions Tj = 150 °C, 10 ms, sin 180° Tj = 25 °C, VRRM = 1700 V Tj = 125 °C, VRRM = 1700 V Tj = 25 °C, IF = 55 A Tj = 125 °C, IF = 55 A Tj = 125 °C Tj = 125 °C min.
typ.
max.
1500 0.
20 8.
00 Unit A2s mA mA V V V mΩ 2.
05 1.
80 1.
11 1.
2 2.
50 2.
30 Features • low forward voltage drop combined with a low temperature dependence • easy paralleling due to a small forward voltage spread • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to all standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 50 A, 1200 V, 800 A/µs Tj = 125 °C, 50 A, 1200 V, 800 A/µs Tj = 25 °C, 50 A, 1200 V, 800 A/µs Tj = 125 °C, 50 A, 1200 V, 800 A/µs Tj = 25 °C, 50 A, 1200 V, 800 A/µs Tj = 125 °C, 50 A, 1200 V, 800 A/µs min.
typ.
max.
Unit µs ns 6 15 45 µC µC A A Typical Applications* • freewheeling diode for IGBT • particularly suitable for frequencies > 8 kHz Thermal Characteristics Symbol Tj Tstg Tsolder Tsolder Rth(j-s) 10 min.
5 min.
sold.
on 0,38 mm DCB, reference point on copper heatsink close to the chip 0.
7 Conditions min.
-40 -40 typ.
max.
150 150 250 320 Unit °C °C °C °C K/W Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 6.
8 x 6.
8 47 bondable (Al) solderable (Ag/Ni) Al, diameter ≤ 500 µm wafer frame 208 (5" Wafer) Unit mm2 mm2 pcs SKCD © by SEMIKRON www.
DataSheet4U.
net Rev.
1 – 18.
02.
2010 1 SKCD 47 C 170 I This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications...


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