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SI5504BDC

Vishay Siliconix
Part Number SI5504BDC
Manufacturer Vishay Siliconix
Description N-/P-Channel MOSFET
Published Jan 20, 2012
Detailed Description www.vishay.com Si5504BDC Vishay Siliconix N- and P-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY N-Channel P-Channel VD...
Datasheet PDF File SI5504BDC PDF File

SI5504BDC
SI5504BDC

Overview
www.
vishay.
com Si5504BDC Vishay Siliconix N- and P-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY N-Channel P-Channel VDS (V) 30 -30 RDS(on) () 0.
065 at VGS = 10 V 0.
100 at VGS = 4.
5 V 0.
140 at VGS = -10 V 0.
235 at VGS = -4.
5 V ID (A) 4a 4a -3.
7 -2.
8 Qg (TYP.
) 2 nC 2.
2 nC 1206-8 ChipFET® Dual D2 D2 6 D1 7 D1 8 5 1.
8 mm 1 3.
0 mm Top View 1 4 G2 3 S2 2 G1 S1 Bottom View FEATURES • TrenchFET® Power MOSFETs • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 APPLICATIONS • DC/DC for portable applications • Load switch D1 S2 G2 G1 Available Marking Code: EF Ordering Information: Si5504BDC-T1-E3 (Lead (Pb)-free) Si5504BDC-T1-GE3 (Lead (Pb)-free and Halogen-free) S1 D2 N-Channel MOSFET P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL N-CHANNEL P-CHANNEL Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Source Drain Current Diode Current Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) d,e TC = 25 °C TC = 85 °C TA = 25 °C TA = 85 °C TC = 25 °C TA = 25 °C TC = 25 °C TC = 85 °C TA = 25 °C TA = 85 °C VDS VGS ID IDM IS PD TJ, Tstg 30 -30 ± 20 4a -3.
7 3.
8 -2.
7 3.
7 b,c -2.
5 b,c 2.
6 b,c -1.
8 b,c 10 -10 2.
5 -2.
5 1.
3 b,c -1.
3 b,c 3.
12 3.
1 2 2 1.
5 b,c 1.
5 b,c 0.
8 b,c 0.
8 b,c -55 to 150 260 UNIT V A W °C THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient b,f Maximum Junction-to-Foot (Drain) t5s Steady State SYMBOL RthJA RthJF N-CHANNEL TYP.
MAX.
70 85 33 40 P-CHANNEL TYP.
MAX.
70 85 33 40 UNIT °C/W Notes a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See reliability manual for profile.
The ChipFET is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at th...


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