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SI7236DP

Vishay Siliconix
Part Number SI7236DP
Manufacturer Vishay Siliconix
Description Dual N-Channel MOSFET
Published Jan 20, 2012
Detailed Description www.DataSheet.co.kr Si7236DP Vishay Siliconix Dual N-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 20 RDS(on) (Ω)...
Datasheet PDF File SI7236DP PDF File

SI7236DP
SI7236DP

Overview
www.
DataSheet.
co.
kr Si7236DP Vishay Siliconix Dual N-Channel 20-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 20 RDS(on) (Ω) 0.
0052 at VGS = 4.
5 V 0.
007 at VGS = 2.
5 V ID (A)a 60 31 nC 60 Qg (Typ.
) FEATURES • Halogen-free According to IEC 61249-2-21 Available • TrenchFET® Power MOSFET APPLICATIONS • Synchronous Rectification • DC-DC Point-of-Load PowerPAK SO-8 6.
15 mm S1 1 2 5.
15 mm G1 S2 D1 D2 3 4 D1 G2 8 7 D1 D2 G1 D2 G2 6 5 Bottom View S1 N-Channel MOSFET S2 N-Channel MOSFET Ordering Information: Si7236DP-T1-E3 (Lead (Pb)-free) Si7236DP-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current TC = 25 °C TA = 25 °C TC = 25 °C TC = 85 °C Maximum Power Dissipation TA = 25 °C TA = 85 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e Continuous Source-Drain Diode Current TC = 25 °C TC = 85 °C TA = 25 °C TA = 85 °C Symbol VDS VGS ID IDM IS Limit 20 ± 12 60a 60a 20.
7b, c 16.
6b, c 80 38 2.
9b, c 46 29 3.
5b, c 2.
2b, c - 55 to 150 260 Unit V A PD TJ, Tstg W °C THERMAL RESISTANCE RATINGS Symbol Typical Maximum Unit RthJA t ≤ 10 s 26 35 Maximum Junction-to-Ambientb, f °C/W RthJC Maximum Junction-to-Case (Drain) Steady State 2.
2 2.
7 Notes: a.
Package limited b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See Solder Profile (www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f.
Maximum under Steady State conditions is 85 °C/W.
Document Number: 70359 S09-0222-Rev.
B, 09-Feb-0...


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