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SS15P3S

Vishay Siliconix
Part Number SS15P3S
Manufacturer Vishay Siliconix
Description SMD Photovoltaic Solar Cell Protection Schottky Rectifier
Published Jan 31, 2012
Detailed Description www.DataSheet.co.kr New Product SS15P3S Vishay General Semiconductor SMD Photovoltaic Solar Cell Protection Schottky ...
Datasheet PDF File SS15P3S PDF File

SS15P3S
SS15P3S

Overview
www.
DataSheet.
co.
kr New Product SS15P3S Vishay General Semiconductor SMD Photovoltaic Solar Cell Protection Schottky Rectifier FEATURES eSMP Series K ® • Very low profile - typical height of 1.
1 mm • Ideal for automated placement • Guardring for overvoltage protection • Low forward voltage drop, low power losses 1 2 • High efficiency • Low thermal resistance • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according to IEC 61249-2-21 definition TO-277A (SMPC) K Cathode Anode 1 Anode 2 MECHANICAL DATA PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM EAS VF at IF = 15 A TJ max.
15 A 30 V 280 A 20 mJ 0.
42 V 150 °C Case: TO-277A (SMPC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS compliant, and commercial grade Terminals: Matte tin plated leads, solderable J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 1A whisker test per TYPICAL APPLICATIONS For use in solar cell junction box as a bypass diode for protection, using DC forward current without reverse bias.
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER Device marking code Maximum repetitive peak reverse voltage Maximum DC forward current (fig.
1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at IAS = 2.
0 A, TJ = 25 °C Operating junction and storage temperature range Junction temperature in DC forward current without reverse bias, t  1 h (3) SYMBOL SS15P3S 153S UNIT VRRM IF IFSM EAS TOP, TSTG TJ 30 15 (1) 4.
5 (2) 280 20 - 55 to + 150  200 V A A mJ °C °C Notes (1) Mounted on 30 mm x 30 mm Al PCB with 50 mm x 25 mm x 100 mm fin heat sink (2) Free air, mounted on recommended copper pad area (3) Meets the requirements of IEC 61215 Ed.
2 bypass diode thermal test Document Number: 89128 Revision: 13-May-11 For technical questions within your region, please contact one of the fo...


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