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VESD05C-FC1

Vishay
Part Number VESD05C-FC1
Manufacturer Vishay
Description Flip Chip Protection Diode
Published Feb 2, 2012
Detailed Description www.DataSheet.co.kr VISHAY VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description...
Datasheet PDF File VESD05C-FC1 PDF File

VESD05C-FC1
VESD05C-FC1

Overview
www.
DataSheet.
co.
kr VISHAY VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing.
The interconnections are made of solder bumps on i/o pads.
Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.
1 2 19120 Features • ESD protection to IEC 61000-4-2 30 kV (air) • ESD protection to IEC 61000-4-2 8 kV (contact) • ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 mA • 120 W peak pulse power dissipation per line (8/20 µs) • Suitable for high frequency applications (low capacitance, low parasitic inductance) • Low clamping voltage • Minimum PCB space needed (0.
5 mm2), < 0.
55 mm height, only 0.
47 mg/pcs • No need for underfill material and/or additional solder • Can be assembled using standard SMT pick & place equipment, reflow processes per J-STD-020 and assembly methods • Green product Applications Cellular phones Personal digital assistants (PDA), notebook computers MP3 players GPS Digital cameras Bluetooth Audio amplifiers DVD Power management systems Read write heads for hard drives Modules for watches CPU Digital TV’s and sattelites receivers SMART cards Mechanical Data Case: Flip Chip 1005 Standard EIA chip size: 0402 8 mm tape and reel per EIA-481-1-A/IEC60286 Top contacts: 4 solder bumps 100 µm in height (nominal) Bumps of SnAgCu (lead-free)1) 1) also available with PbSn bumps Document Number 85859 Rev.
1.
1, 14-Jul-04 www.
vishay.
com 1 Datasheet pdf - http://www.
DataSheet4U.
net/ www.
DataSheet.
co.
kr VESD05C-FC1 Vishay Semiconductors VISHAY Absolute Maximum Ratings Ratings at 25 °C, ambient temperature unless otherwise specified Parameter Peak pulse power dissipation1) Peak pulse current ESD Air discharge per IEC 61000-4-2 ESD Contact discharge per IEC 61000-4-2 Soldering temperature Soldering time 1) Test condition 8/20 µs p...


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