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RBQ10NS45A

Rohm
Part Number RBQ10NS45A
Manufacturer Rohm
Description Schottky Barrier Diode
Published Apr 3, 2012
Detailed Description RBQ10NS45A Schottky Barrier Diode 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 ●Outline VR 45 V Io 10 A IFSM 50 A ...
Datasheet PDF File RBQ10NS45A PDF File

RBQ10NS45A
RBQ10NS45A

Overview
RBQ10NS45A Schottky Barrier Diode 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 ●Outline VR 45 V Io 10 A IFSM 50 A ●Features High reliability Power mold type Cathode common dual type Low IR ●Inner Circuit Data sheet 　　　 　 　 　 　 　 　 　 　 　　　 ●Application ●Packaging Specifications Switching power supply Packing Embossed Tape Reel Size(mm) 330 Taping Width(mm) 24 ●Structure Quantity(pcs) 1000 Silicon epitaxial planar Taping Code TL Marking BQ10NS45A ●Absolute Maximum Ratings (Tc=25ºC unless otherwise specified) Parameter Symbol Conditions Limits Unit Repetitive peak reverse voltage VRM Duty≦0.
5 45 V Reverse voltage Average rectified forward current Peak forward surge current Junction temperature(1) VR Reverse direct voltage 45 V Io IFSM 60Hz half sin waveform，resistive load， Io/2 per diode，Tc=130℃Max.
60Hz half sin waveform， non-repetitive，per diode，Ta=25℃ 10 50 A A Tj - 150 ℃ Storage temperature Tstg - Note(1) To avoid occurrence of thermal runaway， actual board is to be designed to fulfill dPd/dTj<1/RθJA.
Attention -55 ～ 150 ℃ www.
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　 　 　 　 　　 　 　 1/6 　 2019/05/27_Rev.
003 RBQ10NS45A 　 　 　 　 　 　 　 　 　 　 　 　 　 　　　　　　　　　 Data sheet ●Electrical Characteristics Parameter Forward voltage(1) Reverse current(1) Note (1) Value per diode (Tj=25ºC unless otherwise specified) Symbol Conditions VF IF=5A IR1 VR=40V IR2 VR=45V Min.
Typ.
Max.
Unit - 0.
55 0.
65 V - 5 40 μA - 10 70 μA ●Thermal Characteristics 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 　 Parameter Symbol Min.
Typ.
Max.
Unit Thermal Resistance (Junction to case)(1) (2) Per diode Per device RθJC - - 3.
0 ℃/W - 1.
9 ℃/W Thermal Resistance (Junction to ambient)(1) (3) 　 RθJA - - 55 ℃/W Notes (1) Value is guaranteed by design.
(2) Transient dual interface measurement (TDIM) method.
(3) Mounted on 50 x 50 x 1.
6mm FR4 board，single-sided copper，35μm thickness，reference footprint.
●Characte...


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