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CTLSH1-40M322

Central Semiconductor
Part Number CTLSH1-40M322
Manufacturer Central Semiconductor
Description SURFACE MOUNT HIGH CURRENT LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULE
Published Apr 3, 2012
Detailed Description CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM Central DESCRIPTION: TM...
Datasheet PDF File CTLSH1-40M322 PDF File

CTLSH1-40M322
CTLSH1-40M322

Overview
CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM Central DESCRIPTION: TM Semiconductor Corp.
LOW VF Top View Bottom View The CENTRAL SEMICONDUCTOR CTLSH1-40M322 is a low VF Schottky diode designed for applications where small size and operational efficiency are prime requirements.
With a maximum power dissipation of 1.
45W, and a very small package footprint (approximately equal to the SOT-363), this Tiny Leadless Module (TLM) is capable of dissipating up to 4 times the power of similar devices in a comparable surface mount package.
MARKING CODE: CBA APPLICATIONS: • DC/DC Converters • Reverse Battery Protection • Battery powered applications (Cell phones, PDAs, Digital Camera, MP3 Players, etc.
) TLM322 CASE FEATURES: • High Current (IF = 1.
0A) • Low Forward Voltage Drop (VF=0.
55V Max @ 1.
0A) • High Thermal Efficiency MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current, tp ≤ 1ms Forward Surge Current, tp = 8ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: SYMBOL IR IR IR BVR VF VF VF VF CJ trr TEST CONDITIONS VR= 5.
0V VR= 8.
0V VR= 15V IR= 100µA IF= 10mA IF= 100mA IF= 500mA IF= 1.
0A VR= 4.
0V, f= 1.
0MHz SYMBOL VRRM IF IFRM IFSM PD TJ, Tstg ΘJA 40 1.
0 3.
5 10 1.
45 -65 to +150 86.
20 UNITS V A A A W* °C °C/W* www.
DataSheet.
co.
kr (TA=25°C unless otherwise noted) MIN TYP MAX 10 20 50 UNITS µA µA µA V V V V V pF ns 40 0.
29 0.
36 0.
45 0.
55 50 15 IF=IR= 500mA, Irr= 50mA, RL= 50Ω * FR-4 Epoxy PC Board with copper mounting pad area of 21 mm2 R2 (10-April 2006) Datasheet pdf - http://www.
DataSheet4U.
net/ Central TM CTLSH1-40M322 SURFACE MOUNT HIGH CURRENT, LOW VF SILICON SCHOTTKY DIODE TINY LEADLESS MODULETM Semiconductor Corp.
TLM322 CASE - MECHANICAL OUTLINE Suggested mounting pad layout for maximum power dissipation (Dimensions in mm) www.
DataSheet.
co.
kr LEAD CODE: 1) CATHODE 2) ANO...


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