DatasheetsPDF.com

GS8170DW36C

GSI Technology
Part Number GS8170DW36C
Manufacturer GSI Technology
Description (GS8170DW36C / GS8170DW72C) Double Late Write SigmaRAM
Published Apr 20, 2012
Detailed Description Preliminary GS8170DW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Lat...
Datasheet PDF File GS8170DW36C PDF File

GS8170DW36C
GS8170DW36C

Overview
Preliminary GS8170DW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp 18Mb Σ1x1Dp CMOS I/O Double Late Write SigmaRAM™ 200 MHz–333 MHz 1.
8 V VDD 1.
8 V I/O Features • Double Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump p...


Similar Datasheet


Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)