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GS8170LW36C-200

GSI Technology
Part Number GS8170LW36C-200
Manufacturer GSI Technology
Description (GS8170LW36C / GS8170LW72C) Late Write SigmaRAM
Published Apr 20, 2012
Detailed Description GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read m...
Datasheet PDF File GS8170LW36C-200 PDF File

GS8170LW36C-200
GS8170LW36C-200

Overview
GS8170LW36/72C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM™ Functional Description 200 MHz–333 MHz 1.
8 V VDD 1.
8 V I/O SigmaRAM Family Overview GS8170LW36/72 SigmaRAMs are built in compliance with the SigmaRAM pinout standard for synchronous SRAMs.
They are 18,874,368-bit (18Mb) SRAMs.
This family of wide, very low voltage CMOS I/O SRAMs is des...


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