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GS8170LW72AC-333

GSI Technology
Part Number GS8170LW72AC-333
Manufacturer GSI Technology
Description (GS8170LW36AC / GS8170LW72AC) Late Write SigmaRAM
Published Apr 20, 2012
Detailed Description GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read ...
Datasheet PDF File GS8170LW72AC-333 PDF File

GS8170LW72AC-333
GS8170LW72AC-333

Overview
GS8170LW36/72AC-350/333/300/250 209-Bump BGA Commercial Temp Industrial Temp Features • Late Write mode, Pipelined Read mode • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • Byte write operation (9-bit bytes) • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices • Pb-Free 209-bump BGA package available 18Mb Σ1x1Lp CMOS I/O Late Write SigmaRAM™ 250 MHz–350 MHz 1.
8 V VDD 1.
8 V I/O Bottom View 209-Bump, 14 mm x 22 mm BGA 1 mm Bump Pitch, 11 x 19 Bump Array www.
DataSheet.
co.
kr SigmaRAM Family Overview GS8170LW36/72A SigmaRAMs are built in compliance with the SigmaRAM pinout standard for...


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