DatasheetsPDF.com

MT29F64G08UAAC6

Micron
Part Number MT29F64G08UAAC6
Manufacturer Micron
Description NAND Flash Memory
Published Jun 25, 2012
Detailed Description Micron Confidential and Proprietary 16, 32, 64, 128Gb NAND Flash Memory Features NAND Flash Memory MT29F16G08MAAWP, MT...
Datasheet PDF File MT29F64G08UAAC6 PDF File

MT29F64G08UAAC6
MT29F64G08UAAC6

Overview
Micron Confidential and Proprietary 16, 32, 64, 128Gb NAND Flash Memory Features NAND Flash Memory MT29F16G08MAAWP, MT29F32G08QAAWP, MT29F64G08TAAWP, MT29F16G08MAAC3, MT29F32G08RAAC3, MT29F64G08UAAC4, MT29F32G08RAAC6, MT29F64G08UAAC6, MT29F128G08WAAC6 Features • Open NAND Flash Interface (ONFI) 1.
0 compliant • Multilevel cell (MLC) technology • Organization – Page size: x8: 4,314 bytes (4,096 + 218 bytes) – Block size:128 pages (512K + 27K bytes) – Plane size: 2,048 blocks – Device size: 16Gb: 4,096 blocks; 32Gb: 8,192 blocks; 64Gb: 16,384 blocks; 128Gb: 32,768 blocks • READ performance – Random READ: 50µs – Sequential READ: 25ns • WRITE performance – PROGRAM PAGE: 900µs (TYP) – BLOCK ERASE: 3.
5ms (TYP) • Endurance – 10,000 PROGRAM/ERASE cycles (8-bit ECC1) • Data retention: 10 years • First block (block address 00h) guaranteed to be valid when shipped from factory1 • Industry-standard basic NAND Flash command set • Advanced command set – PROGRAM PAGE CACHE MODE – PAGE READ CACHE MODE – One-time programmable (OTP) commands – Two-plane commands – Interleaved die operations – READ UNIQUE ID (contact factory) • Operation status byte provides a software method of detecting: – Operation completion – Pass/fail condition – Write-protect status • Ready/busy# (R/B#) signal provides a hardware method of detecting PROGRAM or ERASE cycle completion • WP# signal: entire device hardware write protect • RESET required after power-up • INTERNAL DATA MOVE operations supported within the plane from which data is read Figure 1: 48-Pin TSOP Type 1 Options www.
DataSheet.
net/ • Density • Device width: x8 • Configuration: Package # of die # of CE# # of R/B# I/O TSOP/LGA 1 1 1 Common TSOP 2 2 2 Common TSOP 4 2 2 Common LGA 2 2 2 Separate LGA 4 2 2 Separate LGA 8 4 4 Separate • VCC: 2.
7–3.
6V • Package: 48 TSOP type I (lead-free plating) – 52-pad ULGA – 52-pad VLGA – 52-pad LLGA • Operating temperature: • Commercial temperature (0°C to 70°C) – Extended temperature (–40°C to +85°C) No...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)