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IRL2203NL

FreesCale
Part Number IRL2203NL
Manufacturer FreesCale
Description Power MOSFET
Published Feb 18, 2013
Detailed Description IRL2203NS/L l l l l l l l Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Tem...
Datasheet PDF File IRL2203NL PDF File

IRL2203NL
IRL2203NL

Overview
IRL2203NS/L l l l l l l l Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175°C Operating Temperature Fast Switching Fully Avalanche Rated 100% RG Tested HEXFET® Power MOSFET D VDSS = 30V RDS(on) = 7.
0mΩ G S ID = 116A‡ Description Advanced HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area.
This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4.
It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.
The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.
0W in a typical surface mount application.
The through-hole version (IRL2203NL) is available for low-profile applications.
http://www.
DataSheet4U.
net/ D2Pak IRL2203NS TO-262 IRL2203NL Absolute Maximum Ratings Symbol ID @ TC = 25°C Parameter Continuous Drain Current, VGS @ 10V Max 116 82 400 3.
8 180 i Units A W W W/°C V A mJ V/ns °C ID @ TC = 100°C Continuous Drain Current, VGS @ 10V Pulsed Drain Current IDM ™ PD @TA = 25°C Power Dissipation PD @TC = 25°C Power Dissipation Linear Derating Factor Gate-to-Source Voltage Avalanche Current VGS IAR EAR dv/dt TJ TSTG Repetitive Avalanche Energy ™ Peak Diode Recovery dv/dt e Ù 1.
2 ± 16 60 18 5.
0 -55 to + 175 300 (1.
6mm from case) Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Thermal Resistance Symbol RθJC RθJA Junction-to-Case k Parameter Typ Max 0.
85 40 Units °C/W Junction-to-Ambient (PCB mount, steady state) jk ––– ––– 1 / 10 www.
freescale.
net.
cn datasheet pdf - http://www.
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