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SIS436DN

Vishay
Part Number SIS436DN
Manufacturer Vishay
Description N-Channel MOSFET
Published Aug 8, 2013
Detailed Description New Product SiS436DN Vishay Siliconix N-Channel 25-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 RDS(on) (Ω) 0.0105 at VGS...
Datasheet PDF File SIS436DN PDF File

SIS436DN
SIS436DN


Overview
New Product SiS436DN Vishay Siliconix N-Channel 25-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 25 RDS(on) (Ω) 0.
0105 at VGS = 10 V 0.
013 at VGS = 4.
5 V ID (A)a, g 16 6.
7 nC 16 Qg (Typ.
) FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Gen III Power MOSFET • 100 % Rg Tested • 100 % UIS Tested PowerPAK® 1212-8 APPLICATIONS • DC/DC Conversion 3.
30 mm D 3.
30 mm S 1 2 3 S S G 4 D 8 7 6 5 D D D G Bottom View Ordering Information: SiS436DN-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Avalanche Current Avalanche Energy TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C L = 0.
1 mH Symbol VDS VGS ID IDM IAS EAS IS Limit 25 ± 20 16a, g 16g 13.
6b, c 10.
7b, c 32g 15 11.
25 16a, g 2.
9b, c 27.
7 17.
7 3.
5b, c 2.
2b, c - 55 to 150 260 Unit V A mJ A TC = 25 °C Continuous Source-Drain Diode Current TA = 25 °C TC = 25 °C TC = 70 °C Maximum Power Dissipation TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e PD TJ, Tstg W °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State Symbol RthJA RthJC Typical 29 3.
6 Maximum 36 4.
5 Unit °C/W Notes: a.
Based on TC = 25 °C.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See Solder Profile (www.
vishay.
com/ppg?73257).
The PowerPAK 1212 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f.
Maximum under Steady State conditions is 81 °C/W.
g.
Package limited.
Do...



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