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SIS478DN

Part Number	SIS478DN
Manufacturer	Vishay
Description	N-Channel MOSFET
Published	Aug 8, 2013
Detailed Description	New Product SiS478DN Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () 0.020 at VGS ...
Datasheet	SIS478DN PDF File

Overview

New Product SiS478DN Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () 0.
020 at VGS = 10 V 0.
030 at VGS = 4.
5 V ID (A)a 12 3.
6 nC 12 Qg (Typ.
) FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg Tested • 100 % UIS Tested • Compliant to RoHS Directive 2002/95/EC PowerPAK 1212-8 APPLICATIONS • Notebook PC 3.
30 mm S 1 2 3 4 D 8 7 6 5 D D D S S G 3.
30 mm - System Power - Load Switch D G Bottom View Ordering Information: SiS478DN-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C) Pulsed Drain Current Continuous Source-Drain Diode Current Single Pulse Avalanche Current Single Pulse Avalanche Energy TC = 25 °C TA = 25 °C L = 0.
1 mH TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Symbol VDS VGS ID IDM IS IAS EAS PD TJ, Tstg Limit 30 ± 25 12a 12a 9.
4b, c 7.
4b, c 40 12a 2.
7b, c 10 5 15.
6 10 3.
2b, c 2b, c - 55 to 150 260 A Unit V mJ TC = 25 °C TC = 70 °C Maximum Power Dissipation TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f W °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, d Maximum Junction-to-Case (Drain) t  10 s Steady State Symbol RthJA RthJC Typical 32 6.
5 Maximum 39 8 Unit °C/W Notes: a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
Maximum under steady state conditions is 81 °C/W.
e.
See solder profile (www.
vishay.
com/ppg?73257).
The PowerPAK 1212 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recomme...

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SIS478DN N-Channel MOSFET - Vishay

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