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SSG4835P

SeCoS
Part Number SSG4835P
Manufacturer SeCoS
Description P-Ch Enhancement Mode Power MOSFET
Published Nov 14, 2013
Detailed Description SSG4835P Elektronische Bauelemente -9.5 A, -30 V, RDS(ON) 19 m P-Ch Enhancement Mode Power MOSFET RoHS Compliant Prod...
Datasheet PDF File SSG4835P PDF File

SSG4835P
SSG4835P

Overview
SSG4835P Elektronische Bauelemente -9.
5 A, -30 V, RDS(ON) 19 m P-Ch Enhancement Mode Power MOSFET RoHS Compliant Product A suffix of “-C” specifies halogen & lead-free DESCRIPTION These miniature surface mount MOSFETs utilize high cell density process.
Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry.
Typical applications are PWMDC-DC converters, power management in portable and battery-powered products such as computers, printers, battery charger, telecommunication power system, and telephones power system.
SOP-8 B L D M A C N J K FEATURES     Low RDS(on) provides higher efficiency and extends battery life.
Miniature SOP-8 surface mount package saves board space.
High power and current handling capability.
Extended VGS range (±25) for battery pack applications.
H G F E REF.
A B C D E F G PACKAGE INFORMATION Package SOP-8 MPQ 2.
5K LeaderSize 13’ inch Millimeter Min.
Max.
5.
80 6.
20 4.
80 5.
00 3.
80 4.
00 0° 8° 0.
40 0.
90 0.
19 0.
25 1.
27 TYP.
REF.
H J K L M N Millimeter Min.
Max.
0.
35 0.
49 0.
375 REF.
45° 1.
35 1.
75 0.
10 0.
25 0.
25 REF.
S S S G D D D D MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current a Pulsed Drain Current b Symbol VDS VGS ID @ TA = 25°C ID @ TA = 70°C IDM IS PD @ TA = 25°C PD @ TA = 70°C TJ, TSTG RθJC RθJA Thermal Resistance Ratings Ratings -30 ±25 -9.
5 -8.
3 ±50 -2.
1 3.
1 2.
6 -55 ~ 150 25 50 Unit V V A A A A W W °C °C / W °C / W Continuous Source Current (Diode Conduction) 1 Total Power Dissipation 1 Operating Junction & Storage Temperature Range Thermal Resistance Junction-Case (Max.
) 1 Notes 1.
2.
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
t ≦ 5 sec Thermal Resistance Junction-Ambient (Max.
) 1 t ≦ 10 sec http://www.
SeCoSGmbH.
com/ Any changes of specification will not be informed individually.
31-Dec-2010 Rev.
B Page 1 ...


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