DatasheetsPDF.com

SQJ443EP

Vishay
Part Number SQJ443EP
Manufacturer Vishay
Description Automotive P-Channel MOSFET
Published Dec 13, 2013
Detailed Description SQJ443EP www.vishay.com Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on)...
Datasheet PDF File SQJ443EP PDF File

SQJ443EP
SQJ443EP


Overview
SQJ443EP www.
vishay.
com Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET PRODUCT SUMMARY VDS (V) RDS(on) (Ω) at VGS = - 10 V RDS(on) (Ω) at VGS = - 4.
5 V ID (A) Configuration - 40 0.
029 0.
047 - 40 Single S FEATURES • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • AEC-Q101 Qualifiedd • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2011/65/EU PowerPAK® SO-8L Single m 5m 6.
1 5.
1 3m m G D 4 G S 3 S 2 S 1 D P-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free PowerPAK SO-8L SQJ443EP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Source Current (Diode Pulsed Drain Currentb Single Pulse Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipationb Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f L = 0.
1 mH TC = 25 °C TC = 125 °C Conduction)a TC = 25 °C TC = 125 °C SYMBOL VDS VGS ID IS IDM IAS EAS PD TJ, Tstg LIMIT - 40 ± 20 - 40 - 23 - 45 - 158 - 28 39 83 28 - 55 to + 175 260 mJ W °C A UNIT V THERMAL RESISTANCE RATINGS PARAMETER Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc SYMBOL RthJA RthJC LIMIT 65 1.
8 UNIT °C/W Notes a.
Package limited.
b.
Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c.
When mounted on 1" square PCB (FR-4 material).
d.
Parametric verification ongoing.
e.
See Solder Profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8L is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S12-0406-Rev.
A, 27-Feb-12 1 Document Number: 63581 THIS DOCUMENT IS SUBJECT TO CH...



Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)