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SQJ463EP

Vishay
Part Number SQJ463EP
Manufacturer Vishay
Description Automotive P-Channel MOSFET
Published Dec 13, 2013
Detailed Description SQJ463EP www.vishay.com Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY VDS (V...
Datasheet PDF File SQJ463EP PDF File

SQJ463EP
SQJ463EP

Overview
SQJ463EP www.
vishay.
com Vishay Siliconix Automotive P-Channel 40 V (D-S) 175 °C MOSFET FEATURES PRODUCT SUMMARY VDS (V) RDS(on) (Ω) at VGS = - 10 V RDS(on) (Ω) at VGS = - 4.
5 V ID (A) Configuration PowerPAK® SO-8L Single S - 40 0.
010 0.
015 - 30 Single • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • AEC-Q101 Qualifiedd • 100 % Rg and UIS Tested • Compliant to RoHS Directive 2002/95/EC m 5m 6.
1 5.
1 3m m G D 4 G S 3 S 2 S 1 D P-Channel MOSFET ORDERING INFORMATION Package Lead (Pb)-free and Halogen-free PowerPAK SO-8L SQJ463EP-T1-GE3 ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage Continuous Drain Currenta Continuous Source Current (Diode Conduction)a Pulsed Drain Currentb L = 0.
1 mH TC = 25 °C TC = 125 °C Single Pulse Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipationb Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)e, f TC = 25 °C TC = 125 °C SYMBOL VDS VGS ID IS IDM IAS EAS PD TJ, Tstg LIMIT - 40 ± 20 - 30 - 30 - 30 - 120 - 44 97 83 28 - 55 to + 175 260 mJ W °C A UNIT V THERMAL RESISTANCE RATINGS PARAMETER Junction-to-Ambient Junction-to-Case (Drain) PCB Mountc SYMBOL RthJA RthJC LIMIT 65 1.
8 UNIT °C/W Notes a.
Package limited.
b.
Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %.
c.
When mounted on 1" square PCB (FR-4 material).
d.
Parametric verification ongoing.
e.
See Solder Profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8L.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
f.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S11-2288-Rev.
D, 28-Nov-11 Document Number: 65540 1 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE...


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