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SI7454CDP

Vishay
Part Number SI7454CDP
Manufacturer Vishay
Description N-Channel 100 V (D-S) MOSFET
Published Apr 22, 2014
Detailed Description New Product Si7454CDP Vishay Siliconix N-Channel 100 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 100 RDS(on) () 0.0305 at ...
Datasheet PDF File SI7454CDP PDF File

SI7454CDP
SI7454CDP

Overview
New Product Si7454CDP Vishay Siliconix N-Channel 100 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 100 RDS(on) () 0.
0305 at VGS = 10 V 0.
033 at VGS = 7.
5 V 0.
043 at VGS = 4.
5 V PowerPAK® SO-8 FEATURES ID (A) 22 21 18.
5 9.
5 nC a Qg (Typ.
) • Halogen-free According to IEC 61249-2-21 Definition • TrenchFET® Power MOSFET • 100 % Rg Tested • 100 % UIS Tested • Compliant to RoHS Directive 2002/95/EC APPLICATIONS 6.
15 mm S 1 2 3 4 D 8 7 6 5 D D D S S G 5.
15 mm • DC/DC Primary Side Switch • Telecom/Server 48 V, Full/Half-Bridge dc-to-dc D • Industrial G Bottom View Ordering Information: Si7454CDP-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current Single Pulse Avalanche Current Single Pulse Avalanche Energy TC = 25 °C TA = 25 °C L =0.
1 mH TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e TJ, Tstg PD IDM IS IAS EAS ID Symbol VDS VGS Limit 100 ± 20 22 17.
6 8.
1b, c 6.
5b, c 40 22 3.
7b, c 15 11.
2 29.
7 19 4.
1b, c 2.
6b, c - 55 to 150 260 W mJ A Unit V °C THERMAL RESISTANCE RATINGS Parameter b, f Maximum Junction-to-Ambient °C/W RthJC Maximum Junction-to-Case (Drain) Notes: a.
Based on TC = 25 °C.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See solder profile (www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f.
Maximu...


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