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11-21UYC-S530-XX-TR8

Everlight
Part Number 11-21UYC-S530-XX-TR8
Manufacturer Everlight
Description 11-21UYC/S530-XX/TR8 1206 Package Chip LEDs
Published May 5, 2014
Detailed Description EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet 1206 Package Chip LEDs with Inner Lens 11-21UYC/S530-XX/TR8 Features...
Datasheet PDF File 11-21UYC-S530-XX-TR8 PDF File

11-21UYC-S530-XX-TR8
11-21UYC-S530-XX-TR8

Overview
EVERLIGHT ELECTRONICS CO.
,LTD.
Technical Data Sheet 1206 Package Chip LEDs with Inner Lens 11-21UYC/S530-XX/TR8 Features ․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS complaint version.
Descriptions ․The 11-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications.
etc.
Applications ․Automotive: backlighting in dashboard and switch.
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General use.
Device Selection Guide Chip Material AlGaInP Emitted Color Part No.
11-21UYC/S530-XX/TR8 Lens Color Water Clear Brilliant Yellow Everlight Electronics Co.
, Ltd.
Device No:SZDSE-111-007 http://www.
everlight.
com Prepared date: 17-Aug-2005 Rev.
1 Page: 1 of 9 Prepared by: Meng Yali http://www.
Datasheet4U.
com EVERLIGHT ELECTRONICS CO.
,LTD.
11-21UYC/S530-XX/TR8 Package Outline Dimensions - + Notes: Tolerances Unless Dimension ±0.
1mm ,Unit = mm Everlight Electronics Co.
, Ltd.
Device No:SZDSE-111-007 http://www.
everlight.
com Prepared date: 17-Aug-2005 Rev.
1 Page: 2 of 9 Prepared by: Meng Yali http://www.
Datasheet4U.
com EVERLIGHT ELECTRONICS CO.
,LTD.
11-21UYC/S530-XX/TR8 Absolute Maximum Ratings (Ta=25℃) Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Electrostatic Discharge(HBM) Power Dissipation Peak Forward Current (Duty 1/10 @1KHz) Soldering Temperature Symbol VR IF Topr Tstg ESD Pd IF Rating 5 25 -40 ~ +85 -40~ +90 2000 60 60 Unit V mA ℃ ℃ V mW mA Tsol Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃) Parameter Symbol *Chip ...


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