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AN-0001

ANADIGICS
Part Number AN-0001
Manufacturer ANADIGICS
Description Surface Mount Assembly
Published May 17, 2014
Detailed Description Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.0 Overview ANADIGICS ...
Datasheet PDF File AN-0001 PDF File

AN-0001
AN-0001

Overview
Assembly of LPCC Packages AN-0001 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages 1.
0 Overview ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package.
These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be correctly soldered for proper electrical contact to the PCB.
The appropriate steps should be taken during PCB design and assembly to guarantee optimum performance from the power amplifiers.
This application note outlines the steps necessary for the handling and assembly of ANADIGICS power amplifiers.
2.
0 Requirements 2.
1 PCB Design Guidelines: 1.
PCB land and solder masking recommendations are shown in Figure 1.
A B SOLDER MASK PCB THERMAL PAD PCB LAND SOLDER MASK OPENING E C D A = Clearance from PCB thermal pad to solder mask opening, 0.
0635 mm minimum B = Clearance from edge of PCB thermal pad to PCB land, 0.
2 mm minimum C = Clearance from PCB land edge to solder mask ope...


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