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NSHC561J50TRA1F

NIC
Part Number NSHC561J50TRA1F
Manufacturer NIC
Description Stacked Film Capacitor Chips
Published May 18, 2014
Detailed Description Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM • STANDARD EIA 0603, 0805, 1...
Datasheet PDF File NSHC561J50TRA1F PDF File

NSHC561J50TRA1F
NSHC561J50TRA1F


Overview
Stacked Film Capacitor Chips FEATURES • STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM • STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES • WIDE TEMPERATURE RANGE UP TO +125OC (100pF ~ 0.
1μF) • HIGH HEAT AND MOISTURE RESISTANT • VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS CHARACTERISTICS • SUITABLE FOR REFLOW SOLDERING • TAPE AND REEL PACKAGING NSHC IS RECOMMENDED FOR NEW DESIGNS NSHC Series includes all homogeneous materials RoHS Compliant *See Part Number System for Details SPECIFICATIONS Capacitance Range Voltage Ratings Capacitance Tolerance Temperature Range Dissipation Factor (20°C) Insulation Resistance (20°C) Dielectric Withstanding Voltage Temperature Characteristic Case Sizes 0603 0805 1206 1210 1913 2416 100pF ~ 0.
0027μF 100pF ~ .
01μF 3300pF ~ .
047μF .
012μF ~ .
1μF .
047μF ~ .
1μF .
12μF ~ .
22μF 16Vdc (12Vrms), 50Vdc (40Vrms) ±5% Std, ±2% Opt.
-55°C ~ +125°C (0.
12μF ~ 0.
22μF voltage derated above +105°C) 0.
6% max.
@ 1KHz 3 Gigohms Minimum 150% of Rated Voltage 60 Seconds or 175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes) ±3% ΔC Maximum Over Temperature Range ENVIRONMENTAL CHARACTERISTICS Life Test At +125°C 1,000 Hours at 125% of Rated Voltage Resistance to Soldering Heat +260°C Peak Humidity Load Life: (1) 1000 Hours, +40°C (2) 500 Hours, +60°C (3) 500 Hours +85°C/85% RH Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Within ±2% of Initial Value 0.
68% Maximum 1 Gigohm Minimum Within ±3% of Initial Value 0.
66% Maximum 1 Gigohm Minimum (1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value (1) & (2) 0.
90% Maximum (3) 1.
2% maximum (1) 1 Gigohm Minimum (2) 0.
5 Gigohm Minimum (3) 0.
01 Gigohm min.
90% Minimum Coverage After 2.
5 Second Dip into 255°C Solder Pot RECOMMENDED REFLOW PROFILE (maximum 2 times) 300 Peak Temperature...



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