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FDZ375P

Fairchild Semiconductor
Part Number FDZ375P
Manufacturer Fairchild Semiconductor
Description P-Channel 1.5V Specified PowerTrench Thin WL-CSP MOSFET
Published May 28, 2014
Detailed Description FDZ375P P-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET April 2010 FDZ375P P-Channel 1.5 V Specified PowerTr...
Datasheet PDF File FDZ375P PDF File

FDZ375P
FDZ375P

Overview
FDZ375P P-Channel 1.
5 V Specified PowerTrench® Thin WL-CSP MOSFET April 2010 FDZ375P P-Channel 1.
5 V Specified PowerTrench® Thin WL-CSP MOSFET -20 V, -3.
7 A, 78 mΩ Features General Description Designed on Fairchild's advanced 1.
5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ375P minimizes both PCB space and rDS(on).
This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).
„ Max rDS(on) = 78 mΩ at VGS = -4.
5 V, ID = -2.
0 A „ Max rDS(on) = 92 mΩ at VGS = -2.
5 V, ID = -1.
5 A „ Max rDS(on) = 112 mΩ at VGS = -1.
8 V, ID = -1.
0 A „ Max rDS(on) = 150 mΩ at VGS = -1.
5 V, ID = -1.
0 A „ Occupies only 1.
0 mm2 of PCB area.
Less than 30% of the area of 2 x 2 BGA „ Ultra-thin package: less than 0.
4 mm height when mounted to PCB „ RoHS Compliant Applications „ Battery management „ Load swit...


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