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SKKH107-16E

Semikron International
Part Number SKKH107-16E
Manufacturer Semikron International
Description Thyristor/Diode
Published Aug 14, 2014
Detailed Description SKKH 107/16 E Absolute Maximum Ratings Symbol Chip IT(AV) ITSM i2t sinus 180° 10 ms 10 ms Tc = 85 °C Tc = 100 °C Tj = 25...
Datasheet PDF File SKKH107-16E PDF File

SKKH107-16E
SKKH107-16E

Overview
SKKH 107/16 E Absolute Maximum Ratings Symbol Chip IT(AV) ITSM i2t sinus 180° 10 ms 10 ms Tc = 85 °C Tc = 100 °C Tj = 25 °C Tj = 130 °C Tj = 25 °C Tj = 130 °C 119 91 2250 1900 25313 18050 1700 1600 1600 Tj = 130 °C Tj = 130 °C 140 1000 -40 .
.
.
130 -40 .
.
.
125 a.
c.
; 50 Hz; r.
m.
s.
1 min 1s 3000 3600 A A A A A²s A²s V V V A/µs V/µs °C °C V V Conditions Values Unit SEMIPACK® 1 Thyristor / Diode Modules SKKH 107/16 E Features • Heat transfer through aluminium oxide ceramic isolated metal baseplate • UL recognized, file no.
E63532 VRSM VRRM VDRM (di/dt)cr (dv/dt)cr Tj Module Tstg Visol Characteristics Symbol Chip VT VT(TO) rT IDD;IRD tgd tgr tq IH IL VGT IGT VGD IGD Rth(j-c) Rth(j-c) Rth(j-c) Module Rth(c-s) Ms Mt a w 75 chip module to heatsink M5 to terminals M5 4.
25 2.
55 0.
22 0.
11 5.
75 3.
45 5 * 9,81 K/W K/W Nm Nm m/s² g Tj = 25 °C, IT = 300 A Tj = 130 °C Tj = 130 °C Tj = 130 °C, VDD = VDRM; VRD = VRRM Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs VD = 0.
67 * VDRM Tj = 130 °C Tj = 25 °C Tj = 25 °C, RG = 33  Tj = 25 °C, d.
c.
Tj = 25 °C, d.
c.
Tj = 130 °C, d.
c.
Tj = 130 °C, d.
c.
continuous DC sin.
180° rec.
120° per chip per module per chip per module per chip per module 2.
5 100 0.
25 4 0.
190 0.
095 0.
200 0.
100 0.
210 0.
105 1 2 200 150 300 250 600 1.
6 0.
8 2.
80 1.
75 0.
9 3.
35 20 V V m mA µs µs µs mA mA V mA V mA K/W K/W K/W K/W K/W K/W Typical Applications* • DC motor control (e.
g.
for machine tools) • AC motor soft starters • Temperature control (e.
g.
for ovens, chemical processes) • Professional light dimming (studios, theaters) Conditions min.
typ.
max.
Unit SKKH © by SEMIKRON Rev.
1 – 23.
12.
2011 1 SKKH 107/16 E Fig.
1L: Power dissipation per thyristor/diode vs.
on-state current Fig.
1R: Max.
power dissipation per chip vs.
ambient temperature Fig.
2L: Max.
power dissipation of one module vs.
rms current Fig.
2R: Max.
power dissipation of one module vs.
case temperature Fig.
3L: Max.
power dissipation of two modules vs.
direct current 2 Fig.
3R: Max.
power diss...


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