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Si7384DP

Vishay
Part Number Si7384DP
Manufacturer Vishay
Description Fast Switching MOSFET
Published Sep 17, 2014
Detailed Description Si7384DP Vishay Siliconix N-Channel Reduced Qg, Fast Switching MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.0085 at...
Datasheet PDF File Si7384DP PDF File

Si7384DP
Si7384DP

Overview
Si7384DP Vishay Siliconix N-Channel Reduced Qg, Fast Switching MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) (Ω) 0.
0085 at VGS = 10 V 0.
0125 at VGS = 4.
5 V ID (A) 18 14 FEATURES • • • • Halogen-free available TrenchFET® Gen II Power MOSFET PWM Optimized for High Efficiency New Low Thermal Resistance PowerPAK® Package with Low 1.
07 mm Profile • 100 % Rg Tested RoHS COMPLIANT PowerPAK SO-8 APPLICATIONS • High-Side DC/DC Conversion - Notebook - Desktop - Server D 6.
15 mm S 1 2 3 S S 5.
15 mm G 4 D 8 7 6 5 D D D G Bottom View Ordering Information: Si7384DP-T1-E3 (Lead (Pb)-free) Si7384DP-T1-GE3 (Lead (Pb)-free and Halogen-free) S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 °C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Avalanche Current Single Pulse Avalanche Energy Maximum Power Dissipationa Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)b, c TA = 25 °C TA = 70 °C Symbol VDS VGS ID IDM IS IAS EAS PD TJ, Tstg 10 s Steady State 30 ± 20 11 8 ± 50 1.
5 25 32 1.
8 1.
1 - 55 to 150 260 Unit V 18 14 4.
1 A L = 0.
1 mH TA = 25 °C TA = 70 °C mJ W °C 5 3.
2 THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambient (MOSFET)a Maximum Junction-to-Case (Drain) t ≤ 10 s Steady State Steady State Symbol RthJA RthJC Typical 21 56 2.
4 Maximum 25 70 3.
0 Unit °C/W Notes: a.
Surface Mounted on 1” x 1” FR4 board.
b.
See Solder Profile ( http://www.
vishay.
com/ppg?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
c.
Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72656 ...


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