DatasheetsPDF.com

SiA432DJ

Vishay
Part Number SiA432DJ
Manufacturer Vishay
Description N-Channel 30 V (D-S) MOSFET
Published Oct 30, 2014
Detailed Description SiA432DJ www.vishay.com Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () 0.0200 at ...
Datasheet PDF File SiA432DJ PDF File

SiA432DJ
SiA432DJ

Overview
SiA432DJ www.
vishay.
com Vishay Siliconix N-Channel 30 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) 30 RDS(on) () 0.
0200 at VGS = 10 V 0.
0240 at VGS = 4.
5 V ID (A) b, c 10.
1 9.
2 Qg (TYP.
) 5.
6 FEATURES • TrenchFET® power MOSFET • Thermally enhanced PowerPAK® SC-70 package - Small footprint area • 100 % UIS tested • Material categorization: For definitions of compliance www.
vishay.
com/doc?99912 please see PowerPAK® SC-70-6L Single S 4 D 5 D 6 APPLICATIONS S D • Load Switch 2 D 1 D G Marking Code: A L Ordering Information: SiA432DJ-T1-GE3 (Lead (Pb)-free and Halogen-free) SiA432DJ-T4-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current Continuous Source-Drain Diode Current Single-Pulse Avalanche Current Single-Pulse Avalanche Energy TC = 25 °C TA = 25 °C L = 0.
1 mH TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) d, e TJ, Tstg PD IDM IS IAS EAS ID SYMBOL VDS VGS LIMIT 30 ± 20 12 a 12 a 10.
1 b, c 8.
1 b, c 30 12 a 2.
9 b, c 15.
5 12 19.
2 12.
3 3.
5 b, c 2.
2 b, c -55 to 150 260 °C W mJ A UNIT V THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient b, f Maximum Junction-to-Case (Drain) t5s Steady State SYMBOL RthJA RthJC TYPICAL 28 5.
3 MAXIMUM 36 6.
5 UNIT °C/W Notes a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SC-70 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework conditions: Manual soldering with a soldering iron is not ...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)