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SiA907EDJT

Vishay
Part Number SiA907EDJT
Manufacturer Vishay
Description Dual P-Channel 20 V (D-S) MOSFET
Published Oct 30, 2014
Detailed Description SiA907EDJT www.vishay.com Vishay Siliconix Dual P-Channel 20 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) -20 RDS(on) (Ω) 0....
Datasheet PDF File SiA907EDJT PDF File

SiA907EDJT
SiA907EDJT

Overview
SiA907EDJT www.
vishay.
com Vishay Siliconix Dual P-Channel 20 V (D-S) MOSFET PRODUCT SUMMARY VDS (V) -20 RDS(on) (Ω) 0.
057 at VGS = -4.
5 V 0.
095 at VGS = -2.
5 V ID (A) -4.
5 a -4.
5 a Qg (TYP.
) 4.
9 nC FEATURES • TrenchFET® power MOSFET • Thermally enhanced Thin PowerPAK® SC-70 package - Small footprint area - Low on-resistance • Typical ESD protection: 1500 V HBM • High speed switching • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 PowerPAK® SC-70-6L Dual S2 4 G2 5 D1 6 D1 D2 APPLICATIONS 1 S1 • Charger Switch, Load Switch for Portable Devices • Battery Management S1 S2 Marking Code: DM Ordering Information: SiA907EDJT-T1-GE3 (Lead (Pb)-free and Halogen-free) SiA907EDJT-T4-GE3 (Lead (Pb)-free and Halogen-free) G1 G2 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER Drain-Source Voltage Gate-Source Voltage TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C TA = 70 °C Pulsed Drain Current (t = 300 μs) Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C TA = 70 °C Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature) d, e TJ, Tstg PD IDM IS ID SYMBOL VDS VGS LIMIT -20 ± 12 -4.
5 a -4.
5 a -4.
5 a, b, c -3.
8 b, c -15 -4.
5 a -1.
6 b, c 7.
8 5 1.
9 b, c 1.
2 b, c -55 to 150 260 °C W A UNIT V THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient b, f Maximum Junction-to-Case (Drain) Notes a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See solder profile (www.
vishay.
com/doc?73257).
The Thin PowerPAK SC-70 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework conditions: Manual soldering with a soldering iron is...


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