DatasheetsPDF.com

SiA913ADJ

Vishay
Part Number SiA913ADJ
Manufacturer Vishay
Description Dual P-Channel 12-V (D-S) MOSFET
Published Oct 30, 2014
Detailed Description New Product SiA913ADJ Vishay Siliconix Dual P-Channel 12-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) - 12 RDS(on) (Ω) 0.06...
Datasheet PDF File SiA913ADJ PDF File

SiA913ADJ
SiA913ADJ

Overview
New Product SiA913ADJ Vishay Siliconix Dual P-Channel 12-V (D-S) MOSFET PRODUCT SUMMARY VDS (V) - 12 RDS(on) (Ω) 0.
061 at VGS = - 4.
5 V 0.
081 at VGS = - 2.
5 V 0.
115 at VGS = - 1.
8 V ID (A) - 4.
5a - 4.
5a - 4.
5 a FEATURES Qg (Typ.
) 8.
2 nC • Halogen-free According to IEC 61249-2-21 • TrenchFET® Power MOSFET • New Thermally Enhanced PowerPAK® SC-70 Package - Small Footprint Area - Low On-Resistance APPLICATIONS PowerPAK SC-70-6 Dual • Load Switch, PA Switch and Battery Switch for Portable Devices S S 1 2 S1 D1 D1 6 5 2.
05 mm G2 4 1 2 G1 D2 D2 3 Part # code Marking Code DIX XXX Lot Traceability and Date code D1 Ordering Information: SiA913ADJ-T1-GE3 (Lead (Pb)-free and Halogen-free) D2 G1 G2 S2 2.
05 mm P-Channel MOSFET P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C Symbol VDS VGS ID IDM IS Limit - 12 ±8 - 4.
5a - 4.
5a - 4.
3b, c - 3.
8b, c - 15 - 4.
5a - 1.
6b, c 6.
5 5 1.
9b, c 1.
2b, c - 55 to 150 260 Unit V Continuous Drain Current (TJ = 150 °C) A Pulsed Drain Current Continuous Source-Drain Diode Current Maximum Power Dissipation PD TJ, Tstg W Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e °C THERMAL RESISTANCE RATINGS Symbol Typical Maximum Unit RthJA t≤5s 52 65 Maximum Junction-to-Ambientb, f °C/W RthJC Maximum Junction-to-Case (Drain) Steady State 12.
5 16 Notes: a.
Package limited.
b.
Surface Mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See Solder Profile (www.
vishay.
com/ppg?73257).
The PowerPAK SC-70 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Conditions: manual soldering...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)