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CIM10F471

Samsung
Part Number CIM10F471
Manufacturer Samsung
Description Chip Bead
Published Dec 2, 2014
Detailed Description Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention appl...
Datasheet PDF File CIM10F471 PDF File

CIM10F471
CIM10F471

Overview
Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones.
FEATURES  Perfect shape for automatic mounting, with no directionality.
 Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.
DIMENSION RECOMMENDED LAND PATTERN 0.
6~0.
8mm 0.
6~0.
8mm 0.
6~0.
8mm 0.
6~0.
8mm Type Dimension [mm] LW t d 10 1.
6±0.
15 0.
8±0.
15 0.
8±0.
15 0.
3±0.
2 DESCRIPTION Part no.
CIB10P100 CIB10P220 CIB10P260 CIB10P300 CIB10P330 CIM10U800 CIM10U121 CIM10U221 CIM10U241 CIM10U301 CIM10U471 CIM10U601 CIM10U102 CIM10U202 CIB10J300 CIM10J400 CIM10J470 CIM10J600 CIM10J750 CIM10J800 CIM10J121 CIM10J151 CIM10J221 CIM10J241 Thickness (mm) 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0.
8±0.
15 0...


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