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NSCT817-25LT3G

ON Semiconductor
Part Number NSCT817-25LT3G
Manufacturer ON Semiconductor
Description General Purpose Transistors
Published Aug 17, 2015
Detailed Description NSCT817−25LT1G, NSCT817−40LT1G General Purpose Transistors NPN Silicon Features • These are Pb−Free Devices MAXIMUM RA...
Datasheet PDF File NSCT817-25LT3G PDF File

NSCT817-25LT3G
NSCT817-25LT3G


Overview
NSCT817−25LT1G, NSCT817−40LT1G General Purpose Transistors NPN Silicon Features • These are Pb−Free Devices MAXIMUM RATINGS Rating Symbol Value Unit Collector − Emitter Voltage Collector − Base Voltage Emitter − Base Voltage Collector Current − Continuous THERMAL CHARACTERISTICS VCEO VCBO VEBO IC 45 V 50 V 5.
0 V 500 mAdc Characteristic Symbol Max Unit Total Device Dissipation FR− 5 Board, (Note 1) TA = 25°C Derate above 25°C PD 225 mW 1.
8 mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C PD 300 mW 2.
4 mW/°C Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W Junction and Storage Temperature TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device.
Maximum Ratings are stress ratings only.
Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.
FR−5 = 1.
0 x 0.
75 x 0.
062 in.
2.
Alumina = 0.
4 x 0.
3 x 0.
024 in 99.
5% alumina.
http://onsemi.
com COLLECTOR 3 1 BASE 2 EMITTER 3 1 2 SOT−23 CASE 318 STYLE 6 MARKING DIAGRAM xxx M G G 1 xxx = Specific Device Code (725 for −25 device) (74L for −40 device) M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location.
ORDERING INFORMATION Device Package Shipping† NSCT817−25LT1G SOT−23 3000 Tape & Reel (Pb−Free) NSCT817−40LT1G SOT−23 3000 Tape & Reel (Pb−Free) NSCT817−25LT3G SOT−23 10,000 Tape & Reel (Pb−Free) NSCT817−40LT3G SOT−23 10,000 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006 May, 2006 − Rev.
0 1 Publication Order Number: NSCT817−25LT1/D NSCT81...



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