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MVGSF1N03L

ON Semiconductor
Part Number MVGSF1N03L
Manufacturer ON Semiconductor
Description N-Channel MOSFET
Published Aug 21, 2015
Detailed Description MGSF1N03L, MVGSF1N03L MOSFET – Single, N-Channel, SOT-23 30 V, 2.1 A These miniature surface mount MOSFETs low RDS(on)...
Datasheet PDF File MVGSF1N03L PDF File

MVGSF1N03L
MVGSF1N03L

Overview
MGSF1N03L, MVGSF1N03L MOSFET – Single, N-Channel, SOT-23 30 V, 2.
1 A These miniature surface mount MOSFETs low RDS(on) assure minimal power loss and conserve energy, making these devices ideal for use in space sensitive power management circuitry.
Typical applications are dc−dc converters and power management in portable and battery−powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.
Features • Low RDS(on) Provides Higher Efficiency and Extends Battery Life • Miniature SOT−23 Surface Mount Package Saves Board Space • MV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±20 V Continuous Drain Current RqJL Steady TA = 25°C ID State TA = 85°C 2.
1 A 1.
5 Power Dissipation RqJL Steady TA = 25°C PD State 0.
69 W Continuous Drain Current (Note 1) Steady TA = 25°C ID State TA = 85°C 1.
6 A 1.
2 Power Dissipation (Note 1) TA = 25°C PD 0.
42 W Pulsed Drain Current ESD Capability (Note 3) tp = 10 ms IDM 6.
0 A C = 100 pF, ESD 125 V RS = 1500 W Operating Junction and Storage Temperature TJ, TSTG −55 to 150 °C Source Current (Body Diode) IS 2.
1 A Lead Temperature for Soldering Purposes TL 260 °C (1/8” from case for 10 sec) THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit Junction−to−Foot − Steady State RqJL 180 °C/W Junction−to−Ambient − Steady State (Note 1) RqJA 300 Junction−to−Ambient − t < 10 s (Note 1) RqJA 250 Junction−to−Ambient − Steady State (Note 2) RqJA 400 Stresses exceeding those listed in the Maximum Ratings table may damage the device.
If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1.
Surface−mounted o...


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