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74CBTLV3245

NXP
Part Number 74CBTLV3245
Manufacturer NXP
Description 8-bit bus
Published Sep 8, 2015
Detailed Description 74CBTLV3245 8-bit bus switch with output enable Rev. 2 — 15 December 2011 Product data sheet 1. General description Th...
Datasheet PDF File 74CBTLV3245 PDF File

74CBTLV3245
74CBTLV3245

Overview
74CBTLV3245 8-bit bus switch with output enable Rev.
2 — 15 December 2011 Product data sheet 1.
General description The 74CBTLV3245 is an 8-pole, single-throw bus switch.
The device features a single output enable input (OE) that controls eight switch channels.
The switches are disabled when OE is HIGH.
Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
2.
Features and benefits  Supply voltage range from 2.
3 V to 3.
6 V  High noise immunity  Complies with JEDEC standard:  JESD8-5 (2.
3 V to 2.
7 V)  JESD8-B/JESD36 (2.
7 V to 3.
6 V)  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  CDM AEC-Q100-011 revision B exceeds 1000 V  5  switch connection between two ports  Rail to rail switching on data I/O ports  CMOS low power consumption  Latch-up performance exceeds 250 mA per JESD78B Class I level A  IOFF circuitry provides partial Power-down mode operation  Multiple package options  Specified from 40 C to +85 C and 40 C to +125 C NXP Semiconductors 74CBTLV3245 8-bit bus switch with output enable 3.
Ordering information Table 1.
Ordering information Type number Package Temperature range Name 74CBTLV3245DS 40 C to +125 C SSOP20[1] 74CBTLV3245PW 40 C to +125 C TSSOP20 74CBTLV3245BQ 40 C to +125 C DHVQFN20 Description Version plastic shrink small outline package; 20 leads; body width 3.
9 mm; lead pitch 0.
635 mm plastic thin shrink small outline package; 20 leads; body width 4.
4 mm plastic dual-in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.
5  4.
5  0.
85 mm SOT724-1 SOT360-1 SOT764-1 [1] Also known as QSOP20 package 4.
Functional diagram A1 A2 A3 A4 A5 A6 A7 A8 23456789 19 OE Fig 1.
Logic sym...


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